An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

Method for the production of a vacuum insulated glazing unit with more than two panes and a vacuum insulated glazing unit with more than two panes. In one example a triple pane vacuum insulated glazing assembly is fused and the cavity is backfilled during cooling whereby the centre pane temperature may be lowered. This has the advantage of keeping the stresses below the failure boundaries and enabling faster production.

A glass frit according to this application may include a composition of P.sub.2O.sub.5, V.sub.2O.sub.5, TeO.sub.2, CuO, ZnO, and BaO configured to replace a conventional lead glass composition and enable a low temperature calcination. A coefficient of thermal expansion (CTE) of the glass frit may be matched with that of a glass substrate. The composition may not include an inorganic filler or at least reduce a content of an inorganic filler to reduce or prevent separation and breakage and to improve durability. The glass frit may be used as a paste for a vacuum glass assembly.

A glass frit according to this application may include a composition of P.sub.2O.sub.5, V.sub.2O.sub.5, TeO.sub.2, CuO, ZnO, and BaO configured to replace a conventional lead glass composition and enable a low temperature calcination. A coefficient of thermal expansion (CTE) of the glass frit may be matched with that of a glass substrate. The composition may not include an inorganic filler or at least reduce a content of an inorganic filler to reduce or prevent separation and breakage and to improve durability. The glass frit may be used as a paste for a vacuum glass assembly.

An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

The present invention relates to a method of joining glass elements with material continuity, to a glass component, to a housing, and to a vacuum insulating panel. The method comprises the following steps providing first and second glass elements, with each of the glass elements having at least one joining region having an outer edge to be joined, introducing a metallic material into the first glass element in the region of the joining region of the first glass element, placing the first and second glass elements onto one another such that the first and second glass elements contact one another at least at one outer edge of the respective joining region; and heating the metallic material in the first glass element so that the glass element at least partially melts in the region of the joining region of the first glass element so that a connection with material continuity is produced between the first and second glass elements.

An outer wall material includes a first transparent member integrally or separately including a transparent plate material and a prism portion; and a reflection member provided on a second side of the prism portion of the first transparent member. The prism portion causes the reflection member to collect light whose angle with respect to a normal line of the plate material is equal to or greater than a predetermined angle and to retro-reflect the collected light, and transmits light whose angle with respect to the normal line of the plate material is less than the predetermined angle.

An outer wall material includes a first transparent member integrally or separately including a transparent plate material and a prism portion; and a reflection member provided on a second side of the prism portion of the first transparent member. The prism portion causes the reflection member to collect light whose angle with respect to a normal line of the plate material is equal to or greater than a predetermined angle and to retro-reflect the collected light, and transmits light whose angle with respect to the normal line of the plate material is less than the predetermined angle.

A standalone lithium ion-conductive solid electrolyte including a freestanding inorganic vitreous sheet of sulfide-based lithium ion conducting glass is capable of high performance in a lithium metal battery by providing a high degree of lithium ion conductivity while being highly resistant to the initiation and/or propagation of lithium dendrites. Such an electrolyte is also itself manufacturable, and readily adaptable for battery cell and cell component manufacture, in a cost-effective, scalable manner.

An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.