Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

A method of manufacturing a glass sheet includes a start point forming step of forming a scribe line on a preset cutting portion of a glass sheet, a setting step of causing, through use of a support member having a groove-shaped recess, the support member to support the glass sheet having the scribe line formed thereon from one surface side so that the preset cutting portion is arranged on the recess, and a cutting step of generating a negative pressure in the recess to bend the preset cutting portion on the recess so that the one surface side protrudes, to thereby cut the glass sheet along the preset cutting portion with the scribe line as the start point. At the time of performing the cutting step, the entire recess is covered with a cover member from another surface side of the glass sheet through intermediation of the glass sheet.

A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion α.sub.core, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion α.sub.clad, where α.sub.clad>α.sub.core; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.

Provided are an apparatus and method for cutting a glass laminate The apparatus comprises a first and second part spaced apart from each other by a first gap, a first guide block and a second guide block spaced apart from each other by a second gap, wherein a saw blade is able to pass through first and second gaps, a first fixing unit and second fixing unit, each capable of fixing the respective first guide block and second guide block to the respective first part and second part of the table, and thus defining a space for a glass laminate.

A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion α.sub.core, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion α.sub.clad, where α.sub.clad>α.sub.core; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.

Provided is a heat reflective member, which is prevented from braking even in a high-temperature environment. It generates no dust in use, and can be washed with a chemical liquid. The heat reflective member has a laminated structure in which quartz glass layers are formed on an upper surface and a lower surface of a siliceous sintered powder layer. The heat reflective member includes: an impermeable layer which is formed at a portion of the siliceous sintered powder layer at an end portion of the heat reflective member, which has a thickness at least larger than half of a thickness of the siliceous sintered powder layer, and through which a gas or a liquid is prevented from penetrating; and a buffer layer which is formed between the impermeable layer and the siliceous sintered powder layer, and which changes in density from the impermeable layer toward the sintered powder layer.

A method of cutting a glass sheet is disclosed. The method comprises heating a heating element to a heat temperature, which in turn heats a glass sheet along a desired cutting line, to a separation temperature. The glass sheet is subjected to non-destructive pressure at an edge on the cutting line. The non-destructive pressure may be applied by a tool with opposed sharp edges so long as the edges do not nick or otherwise score the glass sheet. A diagonal cutter may be utilized as the sharp-edged tool. After an adequate amount of heating time, the glass sheet will achieve the separation temperature and spontaneously separate along the heated cutting line.

Electrochromic device laminates and their method of manufacture are disclosed.

The present application discloses a cutting method and a cutting machine table for cutting a substrate, where the cutting method includes following steps: cutting a large substrate to be cut to obtain a finished substrate falling on a second cutting machine table; after the cutting, driving the second cutting machine table according to a preset parameter to enable a driving-away height difference to be formed between the second cutting machine table and the first cutting machine table; driving the second cutting machine table away from the first cutting machine table; and resetting the second cutting machine table to an initial state.

It comprises a first step of preparing an object; a second step of forming a modified region in a first member along a line by irradiating the first member with laser light while using a front face of the object as a laser light entrance surface; a third step of forming a processing scar in a bonding layer along the line by irradiating the bonding layer with laser light while using the front face as a laser light entrance surface; and a fourth step, after the first to third steps, of forming a modified region in a second member along the line by irradiating the second member with laser light while using a rear face of the object as a laser light entrance surface; the fourth step uses the processing scar as a reference for alignment of a laser light irradiation position with respect to the second member.