This method includes: an initial crack forming step of forming an initial crack (CR1) on a first surface (MG1) of a mother glass sheet (MG); and a laser irradiation step of irradiating the mother glass sheet (MG) with laser light (L) to cause a crack (CR2) to propagate along a preset cleaving line (CL) through use of the initial crack (CR1) as a starting point. The laser irradiation step includes irradiating a second surface (MG2) of the mother glass sheet (MG) with the laser light (L) to heat a surface layer (SL) and an inner portion (IL) of the second surface (MG2), to thereby cause, through a thermal shock caused by the heating, the crack (CR2) to propagate in an entire thickness direction of the mother glass sheet (MG) while propagating along the preset cleaving line (CL).

Disclosed herein are glass articles coated on at least one surface with an electrochromic layer and comprising minimal regions of laser damage, and methods for laser processing such glass articles. Insulated glass units comprising such coated glass articles are also disclosed herein.

A device for producing and removing an internal contour from a planar substrate comprising: a beam-producing- and beam-forming arrangement which is configured to perform: a contour definition step wherein a laser beam is guided over the substrate to produce a plurality of individual zones of internal damage in a substrate material along a contour line defining the internal contour; a crack deformation step, wherein the laser beam is guided over the substrate and produces a plurality of individual zones of internal damage in the substrate material to form a plurality of crack line portions that lead away from the contour line into the internal contour; and a material removal-step, wherein a laser beam directed towards the substrate surface that inscribes a removal line through a thickness of the substrate at the internal contour causes the internal contour to detach from the substrate.

A manufacturing method for a glass film includes at least a cutting step of cutting a strip-shaped glass film while conveying the glass film in a predetermined direction by a conveying device. In the cutting step, the glass film is cut in predetermined cutting zones by irradiating the glass film with laser beams. A support conveyance surface of the conveying device for the glass film is separated at the cutting zones for the glass film. Further, a first surface plate capable of supporting the glass film in a contact manner is disposed at a position that is located in a width direction of the glass film with respect to the cutting zones and corresponds to a center of a glass film obtained by the cutting in the width direction.

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

In a method of manufacturing a glass film, in a cutting step, a crack (CR) formed in a non-product portion (Gc1, Gc2) along a longitudinal direction of a glass film (G2) is guided by a guiding member (17a, 17b) so as to propagate to an outer end portion (Gd) of the non-product portion (Gc1, Gc2) in a width direction.

Provided is a method of manufacturing a glass film, including a cleaving step (S5) of cleaving a band-like glass film (G1) conveyed in a predetermined conveying direction (X) through irradiation of the glass film (G1) with a laser beam (L). The cleaving step (S5) includes: a step of, while supporting a lower surface of the glass film (G1) by a surface plate (22) including an opening (25a), suctioning the glass film (G1) through the opening (25a); and a step of irradiating the glass film (G1) suctioned through the opening (25a) with the laser beam (L).

A method for separating and releasing a closed-form piece from a workpiece made of a brittle material is disclosed. A first pulsed laser-beam creates defects along the outline of the closed-form piece. A second laser-beam selectively heats the closed-form piece for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam is applied for a second time that causes melting and deformation of the closed-form piece. The deformation opens a gap between the closed-form piece and the rest of the workpiece, thereby allowing release of the closed-form piece.

Methods of separating a glass web include exposing a separation path on the glass web to a laser beam that produces thermal stress along the separation path without damaging the glass web. The methods further include redirecting a portion of the laser beam to create a defect on the separation path while the separation path is under thermal stress produced during the exposing the separation path on the glass web to the laser beam, whereupon the glass web separates along the separation path in response to creating the defect. Apparatus are further provided for separating a glass web with at least one laser beam generator that produces a laser beam to heat a separation path and a mirror configured to reflect an end portion of the laser beam to create a defect at a location of the separation path on the glass web.

A position of a band-shaped glass film (1) conveyed downward in a vertical direction is detected by a detection unit (21), and the conveyance speed of each of a plurality of conveyance devices (10, 11, 12, and 14) provided in a horizontal conveyance path (R2) is controlled based on detection data in the detection unit (21). Under a condition that, of the plurality of conveyance devices (10, 11, 12, and 14), the conveyance device (10) located on a most upstream side is defined as an upstream side conveyance device, and the conveyance devices (11, 12, and 14) on a downstream side of the upstream side conveyance device (10) are defined as downstream side conveyance devices, an upper limit and a lower limit are set to the conveyance speed of each of the downstream side conveyance devices (11, 12, and 14).