An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

Disclosed herein is method for fabricating a graphene layer on a non-graphene carbon layer including steps of cleaning and seeding a substrate, depositing a crystalline diamond on the substrate, sputtering an aluminum layer on the crystalline diamond, where the aluminum layer is greater than 5 nanometers and less than 50 nanometers; and treating a surface of the aluminum layer with an ion beam resulting in a graphene layer on the crystalline diamond.

Multilayer metallo-dielectric energy control coatings are disclosed in which one or more layers are formed from a hydrogenated metal nitride dielectric, which may be hydrogenated during or after dielectric deposition. Properties of the multilayer coating may be configured by appropriately tuning the hydrogen concentration (and/or the spatial profile thereof) in one or more hydrogenated metal nitride dielectric layers. One or more metal layers of the multilayer coating may be formed on a hydrogenated nitride dielectric layer, thereby facilitating adhesion of the metal with a low percolation threshold and enabling the formation of thin metal layers that exhibit substantial transparency in the visible spectrum. Optical properties of the coating may be tuned through modulation of metal-dielectric interface roughness and dispersion of metal nanoparticles in the dielectric layer. Electrical busbars and micro-nano electrical grids may be integrated with one or more metal layers to provide functionality such as de-icing and defogging.

Multilayer metallo-dielectric energy control coatings are disclosed in which one or more layers are formed from a hydrogenated metal nitride dielectric, which may be hydrogenated during or after dielectric deposition. Properties of the multilayer coating may be configured by appropriately tuning the hydrogen concentration (and/or the spatial profile thereof) in one or more hydrogenated metal nitride dielectric layers. One or more metal layers of the multilayer coating may be formed on a hydrogenated nitride dielectric layer, thereby facilitating adhesion of the metal with a low percolation threshold and enabling the formation of thin metal layers that exhibit substantial transparency in the visible spectrum. Optical properties of the coating may be tuned through modulation of metal-dielectric interface roughness and dispersion of metal nanoparticles in the dielectric layer. Electrical busbars and micro-nano electrical grids may be integrated with one or more metal layers to provide functionality such as de-icing and defogging.

Provided is a carrier-attached metal foil which can suppress the number of foreign matter particles on the surface of a metal layer to enhance circuit formability, and can keep stable releasability even after heating at a high temperature of 240° C. or higher (for example, 260° C.) for a long period of time. The carrier-attached metal foil includes a carrier, a release functional layer provided on the carrier, the release functional layer including a metal oxynitride, and a metal layer provided on the release functional layer.

Provided is a Low-E glass plate protection method capable of preventing or inhibiting alteration and erosion of Low-E layers. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a tin component. Here, the Low-E layer comprises a tin component. The protective sheet has a PSA layer. The PSA layer comprises a phosphorus compound having a P—OR group. Here, R is a hydrogen atom or an organic group.

A material includes a transparent substrate coated with a stack of thin layers including at least one silver-based functional metal layer. The stack includes a dielectric layer based on silicon and/or aluminum nitride located above a silver-based functional metal layer and an upper protective layer based on zirconium titanium oxide located above the dielectric layer based on silicon and/or aluminum nitride and exhibiting a ratio by weight of titanium to zirconium Ti/Zr of between 60/40 and 90/10.

A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal-nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.

According to at least one feature of the present disclosure, a method of forming an optical element, includes: Depositing an aluminum layer atop a glass substrate via a physical deposition process; depositing a first fluorine containing layer atop the aluminum layer via a physical deposition process; depositing a second fluorine containing layer atop the first fluorine containing layer via a physical deposition process; and depositing a third fluorine containing layer atop the first fluorine containing layer via an atomic layer deposition process.

A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal-nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.