A glass substrate 10 has a mark provided on a surface 10A of the glass substrate 10, the mark including plural dots 104, a depth H of each of the dots 104 is 0.5 μm or larger and 7.0 μm or smaller, and an inclination angle of a side surface 104B of each of the dots 104 is 5° or larger and 56° or smaller.

An article comprises a glass substrate. The glass substrate has a first surface having a plurality of vias therein, and a second surface parallel to the first surface. At least one of the first surface and the second surface is an etched surface having a surface roughness (Ra) of 0.75 nm or less. The glass substrate comprises, in mol percent on an oxide basis: 65 mol %≤SiO.sub.2≤75 mol %; 7 mol %≤Al.sub.2O.sub.3≤15 mol %; 26.25 mol %≤RO+Al.sub.2O.sub.3−B.sub.2O.sub.3; 0 mol %≤R.sub.2O≤2 mol %. RO=MgO+CaO+SrO+BaO+ZnO. R.sub.2O=Li.sub.2O+Na.sub.2O+K.sub.2O+Rb.sub.2O+Cs.sub.2O.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A method of processing a glass material includes guiding and/or focusing light from a light source to glass material in a hot stage of a processing system, where the light source provides light at a wavelength λ that interacts with crystals that may be formed in the glass material. The method includes collecting and/or guiding light directed from the glass material in the hot stage to a wavelength separator, and separating the light directed from the glass material to provide a spectrum δ having wavelengths that are within about twenty nanometers of the wavelength λ. The method includes observing with a detector light of the spectrum δ to identify nano-scale shifts in the wavelength λ caused by interaction with crystals, if present, within the glass material in the hot stage of the processing system.

A method of repairing a glass of a display device includes disposing the glass including a first surface, a second surface opposite to the first surface, and a scratch formed on the first surface, the scratch facing toward a gravitational direction, disposing a heating plate on the first surface of the glass, and irradiating a laser on the second surface. A transmittance rate of the laser passing through the glass is greater than an absorption rate of the laser being absorbed in the glass. A portion of the laser irradiated to the second surface reaches the heating plate. The laser reaching the heating plate generates heat. Heat is transmitted to the glass. A portion of the glass adjacent to the scratch is melted by the heat. The portion of the melted glass fills the scratch.

A method of Bessel beam laser processing for forming through glass vias is adapted for processing a glass substrate having a thickness of less than or equal to 1000 micrometers. The glass substrate is processed by a Bessel beam laser to form a pilot through via and is etched to enlarge the pilot through via to form a through glass via having a diameter ranging from 25 micrometers to 200 micrometers. The Bessel beam laser has a pulse width ranging from 10 picoseconds to 20 picoseconds and is converted as a Bessel beam passing through the glass substrate to form the pilot through via. The through glass via with a smooth interior surface is formed.

A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.

A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

Methods, apparatus, and systems for mitigating pinhole defects in optical devices such as electrochromic windows. One method mitigates a pinhole defect in an electrochromic device by identifying the site of the pinhole defect and obscuring the pinhole to make it less visually discernible. In some cases, the pinhole defect may be the result of mitigating a short-related defect.

A glass member includes a recessed portion, wherein in cross-sectional view, an angle formed between a principal surface of the glass member and an edge face of an opening of the recessed portion is 90 degrees to 130 degrees.