A method for obtaining a glazing includes a glass sheet covered, on one of its faces with electroconductive patterns having in at least one area, a so-called extra thickness area, a greater thickness than in the other areas, the method including depositing by screenprinting a first electroconductive layer forming patterns on one side of the glass sheet, then depositing by a digital printing technique, in the or each extra thickness area, a second electroconductive layer on the first layer while the latter is still wet, then a heat treatment step to cure the first and the second layer.

A method of bonding transparent substrates is provided, comprising: preparing a pair of transparent substrates; forming a thin film of aluminum oxide by a sputtering method, on a bonding surface of the transparent substrates; contacting the aluminum oxide thin films in the air to bond the pair of transparent substrates; and heating the bonded pair of transparent substrates.

This glass bonding material (21) is made of a cladding material (1) in which at least a first layer (11) made of an Al-based alloy and configured to be bonded to glass and a second layer (12) made of an Fe—Ni based alloy having a thermal expansion coefficient from 30° C. to 400° C. of 11.5×10.sup.−6 (K.sup.−1) or less are bonded.

Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emission wavelength of the laser, depositing an intermediate bonding contour layer on one or both of the substrates; depositing electronic device components on one or both of the substrates; joining the first substrate and second substrate with the electronic device components in-between the substrates; using the laser to direct a laser beam onto the intermediate bonding contour layer with a predefined progressive scan pattern, such that the intermediate bonding contour layer is progressively melted and forms a seal, bonding the substrates together. Preferably, each linear laser pass overlaps longitudinally the previous and the following linear laser passes along said contour. Preferably, each linear laser pass is followed by a partial backtrack of the each linear laser pass, such that a part of the linear laser pass overlaps longitudinally the previous linear laser pass.

Coated glass articles for a glass-ceramic ceramming process including a parting agent coated on a surface of the glass article. The parting agent coating can comprise an aqueous dispersion comprising amorphous silicon dioxide agglomerate particles and a dispersant. The parting agent coating can be dried to forming a parting layer for glass articles in a glass stack for a ceramming process that transforms the glass articles into glass-ceramic articles.

A pump-out tube for evacuating a space between two sheets of glass, the pump out tube being receivable in a hole formed in at least one of the sheets of glass, the pump out tube formed as a separate element comprising a tubular member and a seal formed around the tube.

A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1. The ceramic member has a maximum coefficient of thermal expansion of 8-10.sup.−6 K.sup.−1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.

A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1. The ceramic member has a maximum coefficient of thermal expansion of 8-10.sup.−6 K.sup.−1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.

Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emission wavelength of the laser, depositing an intermediate bonding contour layer on one or both of the substrates; depositing electronic device components on one or both of the substrates; joining the first substrate and second substrate with the electronic device components in-between the substrates; using the laser to direct a laser beam onto the intermediate bonding contour layer with a predefined progressive scan pattern, such that the intermediate bonding contour layer is progressively melted and forms a seal, bonding the substrates together. Preferably, each linear laser pass overlaps longitudinally the previous and the following linear laser passes along said contour. Preferably, each linear laser pass is followed by a partial backtrack of the each linear laser pass, such that a part of the linear laser pass overlaps longitudinally the previous linear laser pass.

The present invention relates to structure including an interfacial seal between a glass-ceramic component and a metal component, as well as methods for forming such structures. In particular embodiments, the interfacial seal includes a metal oxide. Such interfacial seals can be beneficial for, e.g., hermetic seals between a glass-ceramic component and a metal component.