Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

An evacuated glazing assembly has first and second spaced-apart, non-metal substrates connected to each other by a seal element to form an evacuable interior space therebetween. The seal element is formed by bonding a metallic bridge element to at least one of the substrates by cold welding to form a first stage seal and forming a second stage seal at least partially in contact with the first stage seal. The seal element is configured to hermetically isolate the interior space from the surrounding environment, and both the first stage seal and the second stage seal contribute to the hermeticity of the seal element.

An evacuated glazing assembly has first and second spaced-apart, non-metal substrates connected to each other by a seal element to form an evacuable interior space therebetween. The seal element is formed by bonding a metallic bridge element to at least one of the substrates by cold welding to form a first stage seal and forming a second stage seal at least partially in contact with the first stage seal. The seal element is configured to hermetically isolate the interior space from the surrounding environment, and both the first stage seal and the second stage seal contribute to the hermeticity of the seal element.

It is demanded that a LTCC substrate composition capable of maintaining low relative permittivity k and high Q value without having a reactivity with a silver which is an electrode material and causing migration of the silver during a co-firing operation at a low temperature. Provided with a low temperature co-fired substrate composition containing 83 to 91 wt. % of CaO-B.sub.2O.sub.3-SiO.sub.2 based glass powder, 7.5 to 14 wt. % of two or more kinds of nanometer-sized SiO.sub.2 powders having different ranges of particle diameter and 1.5 to 3 wt. % of β-wollastonite powder as a crystallization agent wherein the glass powder contains 40.0 to 45.0 wt. % of CaO, 9.0 to 20.0 wt. % of B.sub.2O.sub.3 and 40.0 to 46.0 wt. % of SiO.sub.2.

The present invention relates to a method of joining glass elements with material continuity, to a glass component, to a housing, and to a vacuum insulating panel. The method comprises the following steps providing first and second glass elements, with each of the glass elements having at least one joining region having an outer edge to be joined, introducing a metallic material into the first glass element in the region of the joining region of the first glass element, placing the first and second glass elements onto one another such that the first and second glass elements contact one another at least at one outer edge of the respective joining region; and heating the metallic material in the first glass element so that the glass element at least partially melts in the region of the joining region of the first glass element so that a connection with material continuity is produced between the first and second glass elements.

This glass bonding material (21) is made of a cladding material (1) in which at least a first layer (11) made of an Al-based alloy and configured to be bonded to glass and a second layer (12) made of an Fe—Ni based alloy having a thermal expansion coefficient from 30° C. to 400° C. of 11.5×10.sup.−6 (K.sup.−1) or less are bonded.

This glass bonding material (21) is made of a cladding material (1) in which at least a first layer (11) made of an Al-based alloy and configured to be bonded to glass and a second layer (12) made of an Fe—Ni based alloy having a thermal expansion coefficient from 30° C. to 400° C. of 11.5×10.sup.−6 (K.sup.−1) or less are bonded.

The present invention relates to a glass, in particular a glass for the joining of glass panes for the production of vacuum insulating glasses at processing temperatures ≦420° C., to the corresponding composite glass, and to the corresponding glass paste. Moreover, the present invention relates to a vacuum insulating glass produced using the glass paste according to the invention, to the production process thereof, and to the use of the inventive glass and/or composite glass, and glass paste. The glass according to the invention is characterized in that it comprises the following components, in units of mol-%: V.sub.2O.sub.5 5-58 mol-%,Te0.sub.2 40-90 mol-%, and at least one oxide selected from ZnO 38-52 mol-%, or Al.sub.2O.sub.3 1-25 mol %, or MoO.sub.3 1-10 mol-%, or WO.sub.3 1-10 mol-%, or a combination thereof.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.