Provided are a glass composition capable of sealing through low-temperature firing without containing environmentally harmful lead, and a sealing material using the same. The glass composition includes, in terms of mol %, 1%, to 30% of MgO+CaO+SrO+BaO+ZnO, 30% to 80% of TeO.sub.2, and 5% to 30% of MoO.sub.3.

Glass comprising a colored layer, wherein the glass contains one or more glass components selected from the group consisting of Sb ions, As ions, Sn ions, and Ce ions in an amount of 0.075 cation % or more.

An optical glass includes La.sup.3+, Zn.sup.2+, Nb.sup.5+, and Ti.sup.4+ as a cation configuring glass. La.sup.3+, Zn.sup.2+, Nb.sup.5+, and Ti.sup.4+ which satisfy 10 cat %≤La.sup.3+≤20 cat %, 10 cat %≤Zn.sup.2+≤60 cat %, 20 cat %≤Nb.sup.5+≤60 cat %, and 0 cat %≤Ti.sup.4+≤40 cat % expressed by cation %.

A decorative glass article is substantially free of lead oxide, and has a refractive index of 1.9 or more and an Abbe number of 42 or less.

To provide transparent solid spheres with high refractive index and large particle size. The transparent solid spheres of one aspect of the present disclosure include barium oxide, zirconium dioxide, and titanium dioxide on a theoretical oxide basis, and has a refractive index of at least 2.0 and a particle size of 600 micrometers or greater.

A method for manufacturing a glass wafer for augmented reality applications includes the steps of: providing the raw wafer; edge-grinding of the raw wafer; lapping the raw wafer; rough polishing the raw wafer; fine polishing the raw wafer to obtain an intermediate wafer; gluing the intermediate wafer on a flat carrier; performing single-side polishing of a first main side of the intermediate wafer; and performing single-side polishing of a second main side of the intermediate wafer.

Embodiments of the invention include a semiconductor light emitting device including a semiconductor structure. The semiconductor structure includes a light emitting layer disposed between an n-type region and a p-type region. A wavelength converting structure is disposed in a path of light emitted by the light emitting layer. A diffuse reflector is disposed along a sidewall of the semiconductor light emitting device and the wavelength converting structure. The diffuse reflector includes a pigment. A reflective layer is disposed between the diffuse reflector and the semiconductor structure. The reflective layer is a different material from the diffuse reflector.

A method for producing ceramizable green glass components provided, as well as apparatus for performing such method and ceramizable green glass components producible by such method. The method is a redrawing process in which a preform is heated, in a deformation zone, to a temperature that enables redrawing of the glass. The deformation zone is particularly small, which permits redrawing of the ceramizable green glass bodies while avoiding ceramization during the redrawing. The method provides plate-like or sheet-like green glass components that have a particularly smooth surface.

Embodiments of the invention include a semiconductor light emitting device including a semiconductor structure. The semiconductor structure includes a light emitting layer disposed between an n-type region and a p-type region. A wavelength converting structure is disposed in a path of light emitted by the light emitting layer. A diffuse reflector is disposed along a sidewall of the semiconductor light emitting device and the wavelength converting structure. The diffuse reflector includes a pigment. A reflective layer is disposed between the diffuse reflector and the semiconductor structure. The reflective layer is a different material from the diffuse reflector.

The present invention relates to a tellurium-oxide-based glass composition for forming a glass-to-metal seal to alloys or metals having a coefficient of thermal expansion higher than 16 ppm/ C., said composition comprising TeO.sub.2, ZnO, TiO.sub.2 and optionally K.sub.2O and being essentially free of lead oxide, sodium oxide and vanadium oxide. In addition it relates to the use of the glass composition according to the invention to form a glass-to-metal seal between copper or a copper alloy and an alloy or a metal having a coefficient of thermal expansion higher than 16 ppm/ C., in particular aluminum alloys. It furthermore relates to a connector comprising a contact made of copper or of copper alloy, an insert and/or shell made of a metal or alloy having a coefficient of thermal expansion higher than 16 ppm/ C. and, by way of glass-to-metal sealant between the contact and the insert and/or shell, a tellurium-oxide-based glass having the composition according to the invention. Lastly, it relates to a process for forming a glass-to-metal seal between a contact made of copper or of copper alloy and an insert and/or shell made of metal or alloy having a coefficient of thermal expansion higher than 16 ppm/ C.