C03C3/21

Decorative porous inorganic layer compatible with ion exchange processes

Embodiments of methods for forming strengthened glass articles comprise providing an exchangeable glass substrate having a coefficient of thermal expansion (CTE) between about 60×10−7°/C. to about 110×10−7°/C., depositing at least one decorative porous inorganic layer onto at least a portion of the surface of the glass substrate, wherein the decorative porous inorganic layer comprises a glass transition temperature (Tg)≥450° C., a glass softening temperature (Ts)≥650° C., wherein the difference in CTE values between the glass substrate and the decorative porous inorganic layer is within 10×10−7°/C.; and curing the glass substrate and the deposited decorative porous inorganic layer at a temperature greater than the Ts of the decorative porous inorganic layer; and chemically strengthening the cured glass substrate and the decorative porous inorganic layer thereon via ion exchange at a temperature below the Tg of the decorative porous inorganic layer.

Decorative porous inorganic layer compatible with ion exchange processes

Embodiments of methods for forming strengthened glass articles comprise providing an exchangeable glass substrate having a coefficient of thermal expansion (CTE) between about 60×10−7°/C. to about 110×10−7°/C., depositing at least one decorative porous inorganic layer onto at least a portion of the surface of the glass substrate, wherein the decorative porous inorganic layer comprises a glass transition temperature (Tg)≥450° C., a glass softening temperature (Ts)≥650° C., wherein the difference in CTE values between the glass substrate and the decorative porous inorganic layer is within 10×10−7°/C.; and curing the glass substrate and the deposited decorative porous inorganic layer at a temperature greater than the Ts of the decorative porous inorganic layer; and chemically strengthening the cured glass substrate and the decorative porous inorganic layer thereon via ion exchange at a temperature below the Tg of the decorative porous inorganic layer.

Phosphate and borate glasses with high elastic moduli
20230227347 · 2023-07-20 ·

Glass compositions with high Young's modulus are disclosed. The glass compositions may include phosphorus oxide (P.sub.2O.sub.5), alumina (Al.sub.2O.sub.3), boron oxide (B.sub.2O.sub.3), lithium oxide (Li.sub.2O), magnesia (MgO), titania (TiO.sub.2), lanthanum oxide (La.sub.2O.sub.3) and other components.

Phosphate and borate glasses with high elastic moduli
20230227347 · 2023-07-20 ·

Glass compositions with high Young's modulus are disclosed. The glass compositions may include phosphorus oxide (P.sub.2O.sub.5), alumina (Al.sub.2O.sub.3), boron oxide (B.sub.2O.sub.3), lithium oxide (Li.sub.2O), magnesia (MgO), titania (TiO.sub.2), lanthanum oxide (La.sub.2O.sub.3) and other components.

Sealing material and multilayered glass panel using same

The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.

COMPOSITION, PASTE AND METHODS

Disclosed is a composition for sealing inorganic substrates. The composition includes a glass frit and optionally a filler material, wherein the glass frit contains: 30 to 65 wt % V.sub.2O.sub.5; 5 to 35 wt % P.sub.2O.sub.5; 0 to 30 wt % TeO.sub.2; 0 to 30 wt % Bi.sub.2O.sub.3; 0 to 15 wt % ZnO; 0 to 10 wt % MnO; 0 to 5 wt % B.sub.2O.sub.3; 0 to 5 wt % total alkali metal oxides; 0 to 2 wt % Nb.sub.2O.sub.5; 0 to 2 wt % WO.sub.3; 0 to 2 wt % MoO.sub.3; 0 to 2 wt % SiO.sub.2; and 0 to 2 wt % Al.sub.2O.sub.3.

GLASS COMPOSITION AND SEALING MATERIAL
20230059274 · 2023-02-23 ·

Provided are a glass composition capable of sealing through low-temperature firing without containing environmentally harmful lead, and a sealing material using the same. The glass composition includes, in terms of mol %, 1%, to 30% of MgO+CaO+SrO+BaO+ZnO, 30% to 80% of TeO.sub.2, and 5% to 30% of MoO.sub.3.

METALLIC LAMINATE SHAPED FLOW PATH MEMBER AND METHOD OF MANUFACTURING THE SAME

A metallic laminate shaped flow path member has both a surface roughness of a flow path inner surface and corrosion resistance at such a level as to be utilizable as a flow path member for use in a supply line for a corrosive fluid in a semiconductor device manufacturing apparatus. A metallic substrate constituting the metallic laminate shaped flow path member has surface irregularities, the inner surface of the flow path of the metallic laminate shaped flow path member is formed with a glass coating layer in such a manner as to fill at least recessed regions of the surface irregularities of the metallic substrate, and the glass coating layer includes at least one of a layer of a P.sub.2O.sub.5—ZnO—Al.sub.2O.sub.3 based glass, a layer of a Bi.sub.2O.sub.3—ZnO—B.sub.2O.sub.3 based glass, and a layer of an SiO.sub.2—B.sub.2O.sub.3—Na.sub.2O based glass.

LIGHT GUIDING PANEL AND IMAGE DISPLAY DEVICE
20220365270 · 2022-11-17 · ·

The present invention relates to a light guide plate containing a glass plate and a resin layer that is formed on at least one major surface of the glass plate, in which the resin layer is made of a resin containing metal oxide fine particles dispersed, and an absolute value of a refractive index difference between the glass plate and the resin layer is 0.07 or smaller over an entire range of a wavelength of 430 nm to 700 nm.

LOW-TEMPERATURE FIRED, LEAD-FREE GLASS FRIT, PASTE, AND VACUUM GLASS ASSEMBLY USING SAME
20230101150 · 2023-03-30 ·

A glass frit according to this application may include a composition of P.sub.2O.sub.5, V.sub.2O.sub.5, TeO.sub.2, CuO, ZnO, and BaO configured to replace a conventional lead glass composition and enable a low temperature calcination. A coefficient of thermal expansion (CTE) of the glass frit may be matched with that of a glass substrate. The composition may not include an inorganic filler or at least reduce a content of an inorganic filler to reduce or prevent separation and breakage and to improve durability. The glass frit may be used as a paste for a vacuum glass assembly.