Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A method for preparing all-solid-state photonic crystal fiber preform by extrusion by aligning the center of the first jacking end of the first jacking rod with the center of the core outlet mold. The adverse effect on this part of extruded core glass by oxygen or other impurities in air during the extrusion out of the core outlets can be avoided. The defects on the core glass surface and the cladding glass surface can be effectively removed, and the purity and quality of the core component in the obtained fiber preform can be improved.

A method for preparing all-solid-state photonic crystal fiber preform by extrusion by aligning the center of the first jacking end of the first jacking rod with the center of the core outlet mold. The adverse effect on this part of extruded core glass by oxygen or other impurities in air during the extrusion out of the core outlets can be avoided. The defects on the core glass surface and the cladding glass surface can be effectively removed, and the purity and quality of the core component in the obtained fiber preform can be improved.

The present disclosure provides glass compositions that include from 45 mol% to about 95 mol% of B203; from about 3 mol% to about 60 m ol% of one or more glass components selected from the group consisting of: K20, Na20, CaO, and MgO; and from about 2 mol% to about 45 mol% of CaF.sub.2, SnF.sub.2, NaF, KF, Na.sub.2PO.sub.3 F, or a combination thereof, where the glass includes less than 30 mol% of CaF.sub.2, SnF.sub.2, or a combination thereof. The glass includes: substantially no CuO; less than 0.1 mol% of Li.sub.20, less than 0.1 mol% of Rb.sub.2O, less than 0.1 mol% of BaO; less than 0.1 mol% of P.sub.20.sub.5; less than 0.1 mol% SiO.sub.2; and less than 30 mol% of MgO. The glass composition may be used to desensitize dentin. The present disclosure also provides dentin-desensitizing compositions, as well as methods and uses of the disclosed glass compositions.

The present disclosure provides glass compositions that include from 45 mol% to about 95 mol% of B203; from about 3 mol% to about 60 m ol% of one or more glass components selected from the group consisting of: K20, Na20, CaO, and MgO; and from about 2 mol% to about 45 mol% of CaF.sub.2, SnF.sub.2, NaF, KF, Na.sub.2PO.sub.3 F, or a combination thereof, where the glass includes less than 30 mol% of CaF.sub.2, SnF.sub.2, or a combination thereof. The glass includes: substantially no CuO; less than 0.1 mol% of Li.sub.20, less than 0.1 mol% of Rb.sub.2O, less than 0.1 mol% of BaO; less than 0.1 mol% of P.sub.20.sub.5; less than 0.1 mol% SiO.sub.2; and less than 30 mol% of MgO. The glass composition may be used to desensitize dentin. The present disclosure also provides dentin-desensitizing compositions, as well as methods and uses of the disclosed glass compositions.

The present disclosure provides glass compositions that include from about 20 mol % to 45 mol % of B.sub.2O.sub.3; and from about 10 mol % to about 80 mol % of one or more glass components selected from the group consisting of CaO and MgO. The glass compositions also include less than 0.1 mol % CdO. The glass compositions may include one or more of Na.sub.2O, K.sub.2O, and a phosphate source, where the B2O3 and the phosphate source total about 60 mol % or less. The glass compositions may include a source of fluoride. The glass composition may be used to desensitize dentin. The present disclosure also provides dentin-desensitizing compositions, as well as methods and uses of the disclosed glass compositions.

Provided is a sulfide solid electrolyte containing lithium, phosphorus, sulfur and chlorine, in which a molar ratio of the chlorine to the phosphorus, c (Cl/P), is greater than 1.0 and 1.9 or less, the sulfide solid electrolyte includes an argyrodite-type crystal structure, and a lattice constant of the argyrodite-type crystal structure is 9.820 Å or less.

A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ.sub.tensile stress location)/(σ.sub.interface laser weld))<<1 or <1 and σ.sub.interface laser weld>10 MPa or >1 MPa where σ.sub.tensile stress location is the stress present in the first substrate and σ.sub.interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ.sub.tensile stress location)/(σ.sub.interface laser weld))<<1 or <1 and σ.sub.interface laser weld>10 MPa or >1 MPa where σ.sub.tensile stress location is the stress present in the first substrate and σ.sub.interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.