A method and a device for hermetically encapsulating components using at least one gas discharge lamp, an inorganic material that is transparent for light and a light-absorbing inorganic medium, are provided. With a suitable selection, inorganic materials or inorganic media guarantee a very low level of permeability for oxygen, water vapor and reactive gases in contrast to organic materials or organic media. The encapsulation occurs in a time period of less than one second. In addition, the average temperature of the component only increases slightly, such that even components with temperature-sensitive regions can be encapsulated.

There is disclosed a heat-insulating member including a pair of substrates and an airtight sealing part, in which the airtight sealing part is formed in an outer peripheral part between the pair of substrates to form a space between the pair of substrates, the space being in a vacuum or reduced pressure state, a sealing material that forms the airtight sealing part includes a low-melting glass, and the low-melting glass contains a vanadium oxide, barium oxide, phosphorus oxide, and tungsten oxide, in which the following two relational expressions are satisfied in terms of oxide contents: V.sub.2O.sub.5+BaO+P.sub.2O.sub.5+WO.sub.390 and V.sub.2O.sub.5>BaO>P.sub.2O.sub.5>WO.sub.3 (wherein unit: mol %). Thereby, influence on environmental impact can be reduced and maintenance of airtightness and an improvement in acid resistance can be achieved.

A method and a device for hermetically encapsulating components using at least one gas discharge lamp, an inorganic material that is transparent for light and a light-absorbing inorganic medium, are provided. With a suitable selection, inorganic materials or inorganic media guarantee a very low level of permeability for oxygen, water vapor and reactive gases in contrast to organic materials or organic media. The encapsulation occurs in a time period of less than one second. In addition, the average temperature of the component only increases slightly, such that even components with temperature-sensitive regions can be encapsulated.