A method of manufacturing an epitaxy substrate is provided. A handle substrate is provided. A beveling treatment is performed on an edge of a device substrate such that a bevel is formed at the edge of the device substrate, wherein a thickness of the device substrate is greater than 100 μm and less than 200 μm. An ion implantation process is performed on a first surface of the device substrate to form an implantation region within the first surface. A second surface of the device substrate is bonded to the handle substrate for forming the epitaxy substrate, wherein a bonding angle greater than 90° is provided between the bevel of the device substrate and the handle substrate, and a projection length of the bevel toward the handle substrate is between 600 μm and 800 μm.

A method for manufacturing an optical element is a method for manufacturing an optical element in which laser light is transmitted, reciprocated, or reflected, and the method includes a first step of obtaining a bonded element formed by subjecting a first element part and a second element part, both being transparent to laser light, to surface activated bonding with a non-crystalline layer interposed therebetween; and after the first step, a second step of crystallizing at least a portion of the non-crystalline layer by raising the temperature of the bonded element. In the second step, the temperature of the bonded element is raised to a predetermined temperature that is lower than the melting points of the first element part and the second element part.

A wiring board includes an insulating substrate and a wiring conductor. The insulating substrate includes a first layer having an upper surface and a lower surface and having a first content of aluminum oxide and containing mullite and a second layer stacked on the upper surface and/or the lower surface of the first layer and having a second content of aluminum oxide greater than the first content. The wiring conductor is located inside the first layer and contains a manganese compound and/or a molybdenum compound. A manganese silicate phase and/or a magnesium silicate phase in an interface area between the insulating substrate and the wiring conductor.

Provided is a ceramic member in which the difference in thermal expansion coefficient between an insulating ceramic material and an electrically conductive ceramic material is extremely small and therefore any mismatch caused in association with this difference in thermal expansion coefficient does not occur, and which does not undergo any failure such as breakage, cracking, detachment or destruction. The ceramic member (1) includes an electrically conductive ceramic material (2) which contains yttrium oxide as the main component and additionally contains a fibrous electrically conductive substance such as carbon nanotubes in an amount of 0.1 to 3 vol % inclusive and an insulation ceramic material (3) which contains yttrium oxide as the main component, wherein the electrically conductive ceramic material (2) and the insulation ceramic material (3) are adhered to each other in an integrated manner through an adhesive layer (4) which includes an inorganic adhesive material.

A method is described for assembling at least two parts made of silicon carbide based materials by non-reactive brazing in an oxidizing atmosphere, each of the parts comprising a surface to be assembled, wherein the parts are placed in contact with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient for completely or at least partially melting the brazing composition, or rendering the brazing composition viscous, and the parts and the brazing composition are cooled so as to form, after cooling the latter to ambient temperature, a moderately refractory joint. The non-reactive brazing composition is a composition A consisting of silica (SiO.sub.2), alumina (Al.sub.2O.sub.3), and calcium oxide (CaO), or a composition B consisting of alumina (Al.sub.2O.sub.3), calcium oxide (CaO), and magnesium oxide (MgO), and, before heating the assembly formed by the parts and the brazing composition to the brazing temperature, a supply of silicon in a non-oxidized form is carried out on the surfaces to be assembled of the parts to be assembled, and/or on the surface layers comprising the surfaces to be assembled of the parts to be assembled, and/or in the brazing composition.

A joined body 10 includes a ceramic body 12, a metal member 14, and a joint portion 15 that joins the ceramic body 12 and the metal member 14 together. The joint portion 15 includes a first joint layer 16 joined to the ceramic body 12 and a second joint layer 18 joined to the metal member 14. The first joint layer 16 is disposed on the ceramic body 12 side and contains an alloy that contains Fe and Cr as main components, and a compound having a thermal expansion coefficient of 4.0×10.sup.−6 (/° C.) or lower is dispersed in the first joint layer 16. The second joint layer 18 is disposed on the metal member 14 side, contains an alloy that contains Fe and Cr as main components, and has a larger thermal expansion coefficient than the first joint layer 16.

A honeycomb structure including a plurality of porous honeycomb block bodies bound via joining material layers A. Each of the porous honeycomb block bodies includes a plurality of porous honeycomb segments bound via joining material layers B, each of the porous honeycomb segment includes: partition walls that defines a plurality of cells to form flow paths for a fluid, each of cells extending from an inflow end face that is an end face on a fluid inflow side to an outflow end face that is an end face on a fluid outflow side; and an outer peripheral wall located at the outermost periphery. At least a part of the joining material layers A has higher toughness than that of the joining material layers B.

A method for manufacturing an optical element is a method for manufacturing an optical element in which laser light is transmitted, reciprocated, or reflected, and the method includes a first step of obtaining a bonded element formed by subjecting a first element part and a second element part, both being transparent to laser light, to surface activated bonding with a non-crystalline layer interposed therebetween; and after the first step, a second step of crystallizing at least a portion of the non-crystalline layer by raising the temperature of the bonded element. In the second step, the temperature of the bonded element is raised to a predetermined temperature that is lower than the melting points of the first element part and the second element part.

The invention relates to a ceramic molded article (1) that has recesses (2) and comprises at least two plates (joined parts) (3) made of a ceramic material, i.e. a lower base plate (9), an upper cover plate (8) and, optionally, one or more intermediate plates (7) which are stacked on top of each other and are joined to each other on the surfaces thereof to form the molded article (1); a joining material (paste) is placed between the plates (joined parts) (3).

An epitaxy substrate and a method of manufacturing the same are provided. The epitaxy substrate includes a device substrate and a handle substrate. The device substrate has a first surface and a second surface opposite to each other, and a bevel disposed between the first and the second surfaces. The handle substrate is bonded to the second surface of the device substrate, wherein the oxygen content of the device substrate is less than the oxygen content of the handle substrate, and a bonding angle greater than 90° is between the bevel of the device substrate and the handle substrate.