C04B2237/365

Indirect laser brazing of SiC/SiC CMCs for manufacturing and repair

A method of connecting two CMC substrates that includes providing two substrates; placing one substrate approximate to the other substrate, such that at least a portion of the two substrates overlap and define a brazing area; placing a brazing material approximate the brazing area; defining a primary raster pattern that encompasses the brazing area and a portion of the two substrates outside the brazing area; defining a secondary raster pattern that encompasses the brazing area; allowing a laser to scan the primary raster pattern to preheat the brazing area to a temperature below the brazing material's melting point; allowing the laser to scan the secondary raster pattern to heat the brazing area to a temperature that is above the brazing material's melting point; melting and allowing the brazing material to flow within the brazing area; and cooling the brazing area to form a brazed joint connecting the two substrates.

CMC component with integral cooling channels and method of manufacture

A fiber-reinforced component for use in a gas turbine engine includes a first braided fiber sleeve forming a cooling channel and a plurality of fiber plies enclosing the first braided fiber sleeve, with the plurality of fiber plies forming first and second walls separated by the first braided fiber sleeve. The fiber-reinforced component further includes a matrix material between fibers of the braided fiber sleeve and the plurality of fiber plies.

MULTILAYER BODY AND ELECTRONIC COMPONENT FORMED OF SAME
20230044439 · 2023-02-09 ·

A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

CERAMIC JOINED BODY, ELECTROSTATIC CHUCK DEVICE, AND METHOD FOR PRODUCING CERAMIC JOINED BODY

A ceramic joined body (1) includes: a pair of ceramic plates (2,3) that include a conductive material; a conductive layer (4) and an insulating layer (5) that are interposed between the pair of ceramic plates (2, 3); and a pair of intermediate layers (6, 7) that are interposed between the pair of ceramic plates (2, 3) and the conductive layer (4) and are in contact with the pair of ceramic plates (2, 3) and the conductive layer (4).

Semiconductor substrate support with multiple electrodes and method for making same

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

Metal ceramic substrate and method for manufacturing such metal ceramic substrate
20230028429 · 2023-01-26 ·

A carrier substrate (1) for electrical components, in particular metal-ceramic substrate (1) for electrical components, comprising an insulation layer (10), the insulation layer (10) preferably having a material comprising a ceramic or a composite comprising at least one ceramic layer, a component metallization (20) which is formed on a component side (BS) and has a first primary structuring (21), and a cooling part metallization (30) which is formed on a cooling side (KS) opposite the component side (BS) and has a second primary structuring (31), wherein the insulation layer (10), the component metallization (20) and the cooling part metallization (30) are arranged one above the other along a stacking direction (S), and
wherein the first primary structuring (21) and the second primary structuring (31), as viewed in the stacking direction (S), run congruently at least in portions.

Method to produce a ceramic matrix composite with controlled surface characteristics
11697623 · 2023-07-11 · ·

A method to produce a ceramic matrix composite with controlled surface characteristics includes: applying a scrim ply to a surface of a fiber preform, where the fiber preform includes silicon carbide fibers coated with boron nitride; infiltrating the fiber preform and the scrim ply with a slurry, thereby forming an impregnated ply on an impregnated fiber preform; infiltrating the impregnated fiber preform and the impregnated ply with a melt comprising silicon, and then cooling, thereby forming a ceramic matrix composite having a ceramic surface layer thereon, where the ceramic surface layer has a predetermined thickness and is devoid of boron; machining or grit blasting the ceramic surface layer to form an intermediate layer suitable for coating; and depositing an environmental barrier coating on the intermediate layer. Thus, a ceramic matrix composite coated with the environmental barrier coating is formed with the intermediate layer in between.

PLASMA RESISTANT CERAMIC BODY FORMED FROM MULTIPLE PIECES
20230212082 · 2023-07-06 ·

Disclosed is a joined ceramic body comprising a first ceramic portion comprising a first ceramic, a second ceramic portion comprising a second ceramic, and a joining layer formed between the first ceramic portion and the second ceramic portion. The joining layer has a bond thickness of from 0.5 to 20 um and comprises silicon dioxide having a total impurity content of 20 ppm and less. A method of making the joined ceramic body and a joining material are also disclosed.

FRANGIBLE AIRFOIL

An airfoil including a plurality of composite plies extending from a leading edge to a trailing edge and between a tip and a root. The airfoil further includes a frangible airfoil portion at the tip extending between the leading edge and the trailing edge and extending between the tip and a frangible line along a span including a first plurality of composite plies. The frangible airfoil portion includes a first plurality of composite plies including fibers having a first fiber modulus. The airfoil further includes a residual airfoil portion extending from the frangible line to the root along the span including a second plurality of composite plies. The second plurality of composite plies including one or more plies having a second fiber modulus. The second fiber modulus is greater than the first fiber modulus. Further, the residual airfoil portion meets the frangible airfoil portion at the frangible line.

Polycrystalline ceramic substrate, bonding-layer-including polycrystalline ceramic substrate, and laminated substrate

Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α.sub.1/α.sub.2<0.9 and relational expression (2) 0.7<α.sub.3/α.sub.4<0.9 holds, where α.sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and α.sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and α.sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and α.sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.