A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers of which a main component is ceramic and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Ni, Sn and Au.

A method is described. The method is a method for making a constraining ceramic assembly. The method includes applying at least one metallic electrode to a substrate. The method also includes applying a porous ceramic layer to the substrate to cover the metallic electrode. The method also includes sintering the substrate, the porous ceramic layer, and the metallic electrode together at a sintering temperature above a melting point of the metallic electrode.

A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers of which a main component is ceramic and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Ni, Sn and Au.

In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

A manufacturing method of a multilayer ceramic electronic device includes: forming each of stack units by forming each of internal electrode patterns on each of dielectric green sheets, the each of internal electrode patterns including Ni, Sn and Au; forming a multilayer structure by stacking the each of stack units; and firing the multilayer structure, whereby each internal electrode layer is formed from the each of internal electrode patterns and each dielectric layer is formed from the each of the dielectric green sheets wherein, in the each internal electrode layer, an Au concentration near each interface between the each internal electrode layer and the each dielectric layer is larger than an Au concentration in each center portion in a thickness direction.

Methods, processes, systems, devices and apparatus are provided for additive manufacture resulting in the 3D printing of ceramic materials and components with a thickness greater than three millimeters (3 mm). A sulfur-free 3D printable formulation comprises a liquid inorganic polymer resin using Stereolithograpy (SLA) printers and Digital Light Processing (DLP) curing of the polymer resin via the chemical bonding of the materials rather than sintering. Thus, the process has shorter manufacturing intervals, significantly lower energy use and produces larger scale ceramic components having less linear shrinkage, less mass loss and high ceramic yield with no corrosive sulfur compounds present in the ceramic component.

A ceramic electronic device includes: a ceramic body that has a first face and a second face facing with the first face and has an internal electrode layer inside thereof; a pair of external electrodes that cover the first face and the second face; and a spot that is formed on a third face of the ceramic body that is different from the first face and the second face and is an amorphous phase including Ba, Si and O.

In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.

A ceramic electronic device includes: a ceramic body that has a first face and a second face facing with the first face and has an internal electrode layer inside thereof; a pair of external electrodes that cover the first face and the second face; and a spot that is formed on a third face of the ceramic body that is different from the first face and the second face and is an amorphous phase including Ba, Si and O.