In a multilayer ceramic capacitor, an intersection of an interface is defined by a second dielectric ceramic layer, a first internal electrode layer or a second internal electrode layer, and a third dielectric ceramic layer, on a plane including a length direction and a width direction, the second dielectric ceramic layer and the third dielectric ceramic layer include a near intersection region at or near the intersection, and an average particle size of dielectric particles in the near intersection region is smaller than average particle sizes of dielectric particles in the first dielectric ceramic layer, the second dielectric ceramic layer, and the third dielectric ceramic layer.

A ceramic electronic device includes a multilayer structure in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked. Each of the plurality of dielectric layers includes ceramic grains of a main component thereof expressed by (Ba.sub.1−x−yCa.sub.xSr.sub.y)(Ti.sub.1−zZr.sub.z)O.sub.3 (0<x≤0.2, 0≤y≤0.1, 0≤z≤0.1). D3<D1<D2 is satisfied when an average grain diameter of the ceramic grains of the main component of the plurality of dielectric layers in a section in which each two internal electrode layers is D1, an average grain diameter of the ceramic grains of the main component of first dielectric layers which are located at different height positions from the internal electrode layers is D2, an average grain diameter of the ceramic grains of the main component of second dielectric layers which are located at same height positions of the internal electrode layers is D3.

A method for producing a ceramic matrix composite component is disclosed. The method includes providing a plurality of first ceramic fiber plies including a plurality of interconnected tows and a plurality of first pores positioned between adjacent tows. The method includes applying a plurality of first ceramic particles within the plurality of first pores. Next, the method includes applying a plurality of second ceramic fiber plies onto an outer surface of the plurality of first ceramic fiber plies. The second ceramic fiber plies include a plurality of interconnected tows and a plurality of second pores positioned between adjacent tows. The method then includes applying a plurality of second ceramic particles within the plurality of second pores. Further, the plurality of second ceramic particles are larger than the plurality of first ceramic particles. Lastly, the method includes densifying the ceramic matrix composite preform to form the ceramic matrix composite component.

A multilayer ceramic capacitor includes a multilayer body in which a plurality of internal electrodes including Ni and a plurality of ceramic dielectric layers are alternately stacked, and external electrodes. The ceramic dielectric layer includes an inner dielectric layer located between internal electrodes, and an outer dielectric layer located outside in a stacking direction and including at least NiO. A difference between average grain sizes of dielectric grains of the outer dielectric layers and the inner dielectric layers is about 10% or less. A molar amount of NiO with respect to about 100 moles of Ti is larger by about 0.6 mole or more in the outer dielectric layer than in the inner dielectric layer.

A method of manufacturing a multilayer ceramic capacitor includes printing an internal electrode pattern on a dielectric layer, forming a dielectric pattern in a region other than a region in which the internal electrode pattern is printed, laminating dielectric layers to form a multilayer body, exposing the internal electrode pattern and the dielectric pattern from a side surface of the multilayer body, removing at least a portion of the exposed dielectric pattern, and forming a dielectric gap layer on the side surface.

A method of manufacturing a multilayer ceramic capacitor includes printing an internal electrode pattern on a dielectric layer, forming a dielectric pattern in a region other than a region in which the internal electrode pattern is printed, laminating dielectric layers to form a multilayer body, exposing the internal electrode pattern and the dielectric pattern from a side surface of the multilayer body, removing at least a portion of the exposed dielectric pattern, and forming a dielectric gap layer on the side surface.

Method of manufacturing a metal-ceramic substrate (1) which, in the finished state, has a ceramic layer (11) and a metal layer (12) extending along a main extension plane (HSE) and arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE) comprising providing the metal layer (12) and the ceramic layer (11) and bonding the metal layer (12) to the ceramic layer (11) in regions to form a first region (B1), which has a materially bonded connection between the metal layer (12) and the ceramic layer (11), and a second region (B2), in which the metal layer (12) and the ceramic layer (11) are arranged one above the other without a materially bonded connection, as seen in the stacking direction (S).

A process for the production of a dental shaped body, such as a dental blank or a dental restoration, in which a suspension of a zirconium oxide starting material is gelled by means of a gelling agent, and the use of a suspension of a zirconium oxide starting material as dental material, the suspension containing a gelling agent.

A heat-resistant member of the present disclosure is formed of an alumina-based ceramic containing alumina crystals and a glass formed of Si, Ca, Mg, and O, and an area ratio occupied by the glass in an inner portion is larger than an area ratio occupied by the glass in the surface portion.

A composition includes granules in which zirconia particles are aggregated. The granules have an average circularity of 0.81 or greater based on a projected image.