One aspect of the present disclosure provides a composite sheet including a porous sintered ceramic component having a thickness of less than 2 mm and a resin filled into pores of the sintered ceramic component, wherein the curing rate of the resin is 10 to 70%.

Provided is a composite sheet including a porous nitride sintered body having a thickness of less than 2 mm and a resin filled in pores of the nitride sintered body, wherein a filling rate of the resin is 85% by volume or more. Provided is a method for manufacturing a composite sheet including an impregnation step of impregnating pores of a porous nitride sintered body having a thickness of less than 2 mm with a resin composition having a viscosity of 10 to 500 mPa.Math.s to obtain a resin-impregnated body, and a curing step of heating the resin-impregnated body to semi-cure the resin composition filled in the pores.

One aspect of the present disclosure provides a composite sheet including a porous sintered ceramic component having a thickness of less than 2 mm and a resin filled into pores of the sintered ceramic component, wherein the resin is a semi-cured product of a resin composition including a compound having a cyanate group and the content of triazine rings in the resin is 0.6 to 4.0 mass %.

The present disclosure relates to an electrostatic chuck and a method of manufacturing the same. A problem in that the yield of a wafer is reduced due to a partial destruction phenomenon attributable to thermal expansion of an electrostatic chuck is solved and the lifespan of a wafer is increased by making a coefficient of thermal expansion of a lower plate of an electrostatic chuck similar to a coefficient of thermal expansion of an upper plate of the electrostatic chuck.

Disclosed is an epoxide-functional adduct (E2) and an amine-functional adduct (A3) and coating compositions including these adducts. The epoxide-functional adduct (E2) comprises a reaction product of a reaction mixture comprising (a) an epoxy-containing compound (E1) and (b) a diamine comprising a cyclic ring and/or a polyamine comprising a cyclic ring (A1). The amine-functional adduct comprises a reaction product of a reaction mixture comprising the epoxy-functional adduct (E2) and a monoamine, diamine, and/or polyamine (A2), wherein the monoamine, diamine, and/or polyamine (A2) are different than the diamine comprising a cyclic ring and/or the polyamine comprising a cyclic ring (A1). The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.

A composite member (1) satisfies the following expressions. X/(E×|CTE(B)−CTE(A)|)≥50, X/(E×|CTE(B)−CTE(C)|)≥50, Y/|CTE(B)−CTE(A)|×L(BA)≤50, and Y/|CTE(B)−CTE(C)|×L(BC)≥50. X: shear bond strength (MPa) between the heat dissipating base substrate and heat generating member, Y: fracture elongation of the thermoconductive insulating adhesive film, E: modulus of elasticity (MPa) of the thermoconductive insulating adhesive film, CTE(A): linear expansion coefficient (° C..sup.−1) of the heat dissipating base substrate, CTE(B): linear expansion coefficient (° C..sup.−1) of the thermoconductive insulating adhesive film, CTE(C): linear expansion coefficient (° C..sup.−1) of the material of the surface of the heat generating member in contact with the thermoconductive insulating adhesive film, L(BA): initial contact length (m) between the thermoconductive insulating adhesive film and the heat dissipating base substrate, and L(BC): initial contact length (m) between the thermoconductive insulating adhesive film and the heat generating member.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.

A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

A holding device manufacturing method includes a step of preparing a first joined body which includes a pre-machining ceramic member having a first surface and a fifth surface located opposite the first surface and approximately parallel to the first surface, a base member, and a joining portion disposed between the first surface of the pre-machining ceramic member and a third surface of the base member and joining the pre-machining ceramic member and the base member together. The thickness of the joining portion of the first joined body in a first direction, in which the first surface and the third surface face each other via the joining portion, increases from one end side toward the other end side of the joining portion in a second direction perpendicular to the first direction. The method includes a step of machining the fifth surface of the pre-machining ceramic member in the first joined body.