A carrier structure (100), particularly for optical components, includes a carrier body (10) which is formed from ceramic with hollows (11), and at least one cover layer (21, 22) which is formed from glass, arranged on at least one surface of the carrier body (10), and is connected to the carrier body (10) by means of at least one bond connection (23, 24) produced by means of anodic bonding. Methods for producing the carrier structure (100) and the use of the carrier structure as a mirror body, carrier for optical components and/or mechanical carrier for dynamically moved components are also described.

Provided is a silicate glass, a method for preparing a silicate glass-ceramics by using the silicate glass, and a method for preparing a lithium disilicate glass-ceramics by using the silicate glass, and more particularly, to a method for preparing a glass-ceramics that has a nanosize of 0.2 to 0.5 μm and contains lithium disilicate and silicate crystalline phases. A nano lithium disilicate glass-ceramics containing a SiO.sub.2 crystalline phase includes: a glass composition including 70 to 85 wt % SiO.sub.2, 10 to 13 wt % Li.sub.2O, 3 to 7 wt % P.sub.2O.sub.5 working as a nuclei formation agent, 0 to 5 wt % Al.sub.2O.sub.3 for increasing a glass transition temperature and a softening point and enhancing chemical durability of glass, 0 to 2 wt % ZrO.sub.2, 0.5 to 3 wt % CaO for increasing a thermal expansion coefficient of the glass, 0.5 to 3 wt % Na.sub.2O, 0.5 to 3 wt % K.sub.2O, and 1 to 2 wt % colorants, and 0 to 2.0 wt % mixture of MgO, ZnO, F, and La.sub.2O.sub.3.

The object of the present invention is an integrally bonded composite component, a method for the production thereof, and the use thereof. The invention particularly relates to integrally bonded transparent ceramic composite components, to a method for the production of such ceramic composite components, and to the use thereof.

Sintered product having a chemical analysis such that, in mass percentages: SiO.sub.2 content is greater than 0.2% and less than 2%, and CaO content is greater than 0.1% and less than 1.5%, and MgO content is less than 0.3%, and alumina and other elements being the complement at 100%, the content of other elements being less than 1.5%, having a relative density greater than 90%, comprising, for more than 90% of its volume, a stack of ceramic platelets (10) laid flat, all of said platelets having an average thickness less than 3 μm, more than 95% by number of said platelets each containing more than 95% by mass of alumina, having a width (l) greater than 81 mm.

Provided is a silicate glass, a method for preparing a silicate glass-ceramics by using the silicate glass, and a method for preparing a lithium disilicate glass-ceramics by using the silicate glass, and more particularly, to a method for preparing a glass-ceramics that has a nanosize of 0.2 to 0.5 μm and contains lithium disilicate and silicate crystalline phases. A nano lithium disilicate glass-ceramics containing a SiO.sub.2 crystalline phase includes: a glass composition including 70 to 85 wt % SiO.sub.2, 10 to 13 wt % Li.sub.2O, 3 to 7 wt % P.sub.2O.sub.5 working as a nuclei formation agent, 0 to 5 wt % Al.sub.2O.sub.3 for increasing a glass transition temperature and a softening point and enhancing chemical durability of glass, 0 to 2 wt % ZrO.sub.2, 0.5 to 3 wt % CaO for increasing a thermal expansion coefficient of the glass, 0.5 to 3 wt % Na.sub.2O, 0.5 to 3 wt % K.sub.2O, and 1 to 2 wt % colorants, and 0 to 2.0 wt % mixture of MgO, ZnO, F, and La.sub.2O.sub.3.

Provided is a silicate glass, a method for preparing a silicate glass-ceramics by using the silicate glass, and a method for preparing a lithium disilicate glass-ceramics by using the silicate glass, and more particularly, to a method for preparing a glass-ceramics that has a nanosize of 0.2 to 0.5 μm and contains lithium disilicate and silicate crystalline phases. A nano lithium disilicate glass-ceramics containing a SiO.sub.2 crystalline phase includes: a glass composition including 70 to 85 wt % SiO.sub.2, 10 to 13 wt % Li.sub.2O, 3 to 7 wt % P.sub.2O.sub.5 working as a nuclei formation agent, 0 to 5 wt % Al.sub.2O.sub.3 for increasing a glass transition temperature and a softening point and enhancing chemical durability of glass, 0 to 2 wt % ZrO.sub.2, 0.5 to 3 wt % CaO for increasing a thermal expansion coefficient of the glass, 0.5 to 3 wt % Na.sub.2O, 0.5 to 3 wt % K.sub.2O, and 1 to 2 wt % colorants, and 0 to 2.0 wt % mixture of MgO, ZnO, F, and La.sub.2O.sub.3.

Materials that seamlessly transition from opaque to transparent or translucent, such as advanced geopolymer-based ceramics to glass structures, which can be directly and seamlessly bonded without the use of an intermediate adhesive or use of a frame are disclosed. That is, a GP-based ceramic to glass structure can be bonded directly and seamlessly and without any mechanical joints, connective tissue or adhesives such as caulking or epoxy. Such ceramic to glass materials can be prepared by sintering an engineered geopolymer with glass to form the geopolymer-based advanced ceramic-glass structure in which the interface is visually abruptly or in which the material is a graded composition with a controlled transition from one material to the other.

A sensor component for application temperatures above 700° C., especially electrical and/or electrochemical sensor component is provided. The sensor component has a feedthrough element, the feedthrough element having a through-hole with a through-hole inner wall extending from one surface of the feedthrough element to the other surface of the feedthrough element, wherein an insulation element is located within a through-hole of the feedthrough element, the through-hole has a diameter Da, the insulation element has a Volume V and a height H which are compact.

An electronic device housing, a manufacturing method thereof, and an electronic device are provided. The housing includes a bottom plate, and a middle frame connected to the bottom plate. The middle frame is made of glass, and the bottom plate is made of sapphire; or the bottom plate is made of glass, and the middle frame is made of sapphire. An interface-free continuous connection is provided between the bottom plate and the middle frame.

An improved method for embedding one or more sensors in SiC is provided. The method includes depositing a binder onto successive layers of a SiC powder feedstock to produce a dimensionally stable green body have a true-sized cavity. A sensor component is then press-fit into the true-sized cavity. Alternatively, the green body is printed around the sensor component. The assembly (the green body and the sensor component) is heated within a chemical vapor infiltration (CVI) chamber for debinding, and a precursor gas is introduced for densifying the SiC matrix material. During infiltration, the sensor component becomes bonded to the densified SiC matrix, the sensor component being selected to be thermodynamically compatible with CVI byproducts at elevated temperatures, including temperatures in excess of 1000° C.