An electronic device is provided. The electronic device includes a backboard, a circuit board disposed on the backboard, a light source disposed on the circuit board, a housing disposed on the backboard, and a panel disposed on the housing. The panel contacts the housing, and the light source and the circuit board are disposed between the panel and the backboard.

An electronic device is provided. The electronic device includes a back frame, a panel disposed on the back frame, a protective substrate disposed on the panel, and an adhesive element disposed on a portion of the back frame. The back frame and the protective substrate adhere to each other via the adhesive element.

The present invention relates to a glass including, represented by mole percent based on oxides: from 52% to 80% of SiO.sub.2; from 5% to 30% of B.sub.2O.sub.3; from 2% to 30% of Al.sub.2O.sub.3; from 0.1% to 11% of P.sub.2O.sub.5; and from 0.0001% to 5% of Na.sub.2O, in which the glass has an average thermal expansion coefficient α at from 50° C. to 350° C. of from 5×10.sup.−7/° C. or more and 33×10.sup.−7/° C. or less.

The present invention relates to parts of transparent corundum ceramics and the production and use of said parts.

Some embodiments of present disclosure are directed to a micro-perforated glass or glass-ceramics laminate, comprising a first substrate laminated to a second substrate by a first polymer interlayer, wherein the first and the second substrates are independently selected from glass or glass-ceramics, and a plurality of micro-perforations, each of the plurality of micro-perforations extending through the first substrate, the first polymer interlayer, and the second substrate. Some embodiments are directed to methods of forming such micro-perforated glass or glass-ceramics laminates.

A laminated member includes a glass member of which a linear transmittance at a wavelength of 850 nm is 80% or more, a bonding layer provided on or above the glass member, the bonding layer being constituted by a resin, and a ceramic member provided on or above the bonding layer, the ceramic member being constituted by an SiC member or an AlN member.

The present disclosure is directed to a composite material comprising a thermoplastic adhesive and nanotubes oriented in the in-plane orientation. In additional aspects, the disclosure includes a laminated armor material comprising the composite and armor materials.

An electronic device having a curved surface is provided. The electronic device having the curved surface includes a back frame having a curved surface, a panel having a curved surface disposed on the back frame having the curved surface, a protective substrate having a curved surface disposed on the panel having the curved surface, and a patterned adhesive element disposed on a portion of the back frame having the curved surface. The back frame having the curved surface and the protective substrate having the curved surface adhere to each other via the patterned adhesive element. The method for fabricating the electronic device having the curved surface is also provided.

The present disclosure relates to laminated armor materials for enhanced ballistic protection. In particular, the present disclosure relates to laminated armor materials comprising first and second armor materials and a laminated adhesive layer comprising nanomaterial fillers.

The present invention relates to a laminated member, including: a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more; a bonding layer containing a resin and lying on the glass member; and a Si—SiC member lying on the bonding layer, in which the glass member includes predetermined amounts of SiO.sub.2, Al.sub.2O.sub.3, B.sub.2O.sub.3, and P.sub.2O.sub.5, the Si—SiC member has an average linear expansion coefficient α at 20 to 200° C. of 2.85 to 4.00 ppm/° C., and has an average linear expansion coefficient β at 20 to 200° C. of 1.50 to 5.00 ppm/° C., and the laminated member has an absolute value |α−β|, which is a value obtained by subtracting β from α, of 2.00 ppm/° C. or less.