An iron oxide powder includes a porous structure having the diameter of from 0.3 μm to 2 μm, wherein the iron oxide powder has an aluminum content of from 10 mol % to 80 mol %.

An iron oxide powder includes a porous structure having the diameter of from 0.3 μm to 2 μm, wherein the iron oxide powder has an aluminum content of from 10 mol % to 80 mol %.

The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.

The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.

A nano-modified material for cavity wall with insulation for prefabricated building, preparation method and application thereof, belonging to the technical field of building materials. The material includes splicing structures and a nano-modified silane waterproof coating, wherein the splicing structure includes a recycled concrete structure layer and a nano-modified foam concrete thermal insulation core layer, the recycled concrete structure layer is a hollow cuboid structure with openings at both ends, the nano-modified foam concrete thermal insulation core layer is a structure formed by casting inside the recycled concrete structure layer, and the nano-modified silane waterproof coating is applied at a butt joint of two of the splicing structures.

A nano-modified material for cavity wall with insulation for prefabricated building, preparation method and application thereof, belonging to the technical field of building materials. The material includes splicing structures and a nano-modified silane waterproof coating, wherein the splicing structure includes a recycled concrete structure layer and a nano-modified foam concrete thermal insulation core layer, the recycled concrete structure layer is a hollow cuboid structure with openings at both ends, the nano-modified foam concrete thermal insulation core layer is a structure formed by casting inside the recycled concrete structure layer, and the nano-modified silane waterproof coating is applied at a butt joint of two of the splicing structures.

The present invention relates to a metalized ceramic substrate and a method for manufacturing the same. The method for manufacturing a metalized ceramic substrate of the present invention comprises the steps of: mixing copper powder and metal oxide to manufacture a copper paste; applying the copper paste to an upper surface of a ceramic substrate; and sintering the copper paste to form a copper metallization layer on the upper surface of the ceramic substrate. According to the present invention, it is possible to form, on the ceramic substrate, a thin copper metallization layer with high density, high bonding strength and low impurities.

The present invention relates to a metalized ceramic substrate and a method for manufacturing the same. The method for manufacturing a metalized ceramic substrate of the present invention comprises the steps of: mixing copper powder and metal oxide to manufacture a copper paste; applying the copper paste to an upper surface of a ceramic substrate; and sintering the copper paste to form a copper metallization layer on the upper surface of the ceramic substrate. According to the present invention, it is possible to form, on the ceramic substrate, a thin copper metallization layer with high density, high bonding strength and low impurities.

An iron oxide powder which has an aluminum content of from 10 mol % to 80 mol % (inclusive), and which is composed of porous structures that have a diameter of from 0.3 μm to 2 μm (inclusive).

An iron oxide powder which has an aluminum content of from 10 mol % to 80 mol % (inclusive), and which is composed of porous structures that have a diameter of from 0.3 μm to 2 μm (inclusive).