C07C233/16

Acrylamide-containing photo active co-solvents

The present disclosure is drawn to an acrylamide-containing photo active co-solvent, including a bis-tris propane co-solvent or a polypropylene oxide amine co-solvent modified with an acryloyl group to form the acrylamide-containing photo active co-solvent.

Acrylamide-containing photo active co-solvents

The present disclosure is drawn to an acrylamide-containing photo active co-solvent, including a bis-tris propane co-solvent or a polypropylene oxide amine co-solvent modified with an acryloyl group to form the acrylamide-containing photo active co-solvent.

Photoresists comprising amide component

New photoresist compositions are provided that comprise a component that comprises an amide group and multiple hydroxyl groups. Preferred photoresists of the invention may comprise a resin with photoacid-labile groups; a photoacid generator compound; and an amide component with multiple hydroxyl groups that can function to decrease undesired photogenerated-acid diffusion out of unexposed regions of a photoresist coating layer.

Photoresists comprising amide component

New photoresist compositions are provided that comprise a component that comprises an amide group and multiple hydroxyl groups. Preferred photoresists of the invention may comprise a resin with photoacid-labile groups; a photoacid generator compound; and an amide component with multiple hydroxyl groups that can function to decrease undesired photogenerated-acid diffusion out of unexposed regions of a photoresist coating layer.

Materials that provide bioresistance and/or defoaming and slower cooling properties for aqueous quenchants

Methods and compositions are provided for heat treating, e.g. quenching a metal. The quenching composition includes a composition that comprises a polyamidopolyamine compound having a molecular weight of about 500 to about 100,000 and comprising a pendent amino group; and/or a non-polymeric amidoamine having a molecular weight of about 290 to about 5000 and comprising an amino group; and a hydroxyl containing diluent. These compositions impart one or more of the functions of quenching, lubricity, anti/low foaming and/or bioresistance to the quenching fluid.

Materials that provide bioresistance and/or defoaming and slower cooling properties for aqueous quenchants

Methods and compositions are provided for heat treating, e.g. quenching a metal. The quenching composition includes a composition that comprises a polyamidopolyamine compound having a molecular weight of about 500 to about 100,000 and comprising a pendent amino group; and/or a non-polymeric amidoamine having a molecular weight of about 290 to about 5000 and comprising an amino group; and a hydroxyl containing diluent. These compositions impart one or more of the functions of quenching, lubricity, anti/low foaming and/or bioresistance to the quenching fluid.

ACRYLAMIDE-CONTAINING PHOTO ACTIVE CO-SOLVENTS

The present disclosure is drawn to an acrylamide-containing photo active co-solvent, including a bis-tris propane co-solvent or a polypropylene oxide amine co-solvent modified with an acryloyl group to form the acrylamide-containing photo active co-solvent.

Compositions and Methods of Using Polyamidopolyamines and Non-Polymeric Amidoamines

Compositions comprising a polyamidopolyamine and/or a non-poly-meric amidoamine are disclosed for imparting multiple desired characteristics to a variety of industrial compositions. In certain embodiments, these compositions are prepared by condensing a C.sub.4 to C.sub.16 poly basic acid, monobasic acid or derivative thereof with a polyamine comprising a primary amino group, and in the presence of an optional organic diluent. Certain specific polyamidopolyamine and a non-polymeric amidoamine formulae and compositions containing same are disclosed, as are methods of use of these compositions.

Compositions and Methods of Using Polyamidopolyamines and Non-Polymeric Amidoamines

Compositions comprising a polyamidopolyamine and/or a non-poly-meric amidoamine are disclosed for imparting multiple desired characteristics to a variety of industrial compositions. In certain embodiments, these compositions are prepared by condensing a C.sub.4 to C.sub.16 poly basic acid, monobasic acid or derivative thereof with a polyamine comprising a primary amino group, and in the presence of an optional organic diluent. Certain specific polyamidopolyamine and a non-polymeric amidoamine formulae and compositions containing same are disclosed, as are methods of use of these compositions.

Method of treating pain using an acetaminophen dimer ether-linked through phenolic hydroxyl groups
09782369 · 2017-10-10 · ·

Provided herein is a method for treating pain in a subject without risking hepatotoxicity by administering a pharmaceutical composition containing an acetaminophen dimer compound wherein the phenolic hydroxyl groups of two acetaminophen molecules are linked via an ethylene spacer.