C07C39/14

EPOXY COMPOUND, METHOD FOR PRODUCING THE SAME, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF

The present invention provides an epoxy compound which is 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene. Also, the present invention provides a method for producing [1,1′-binaphthalene]-2,2′,7,7′-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1′-binaphthalene]-2,2′,7,7′-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1′-binaphthalene]-2,2′,7,7′-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1′-binaphthalene]-2,2′,7,7′-tetraol or [1,1′-binaphthalene]-2,2′,7,7′-tetraol monohydrate with epihalohydrin.

EPOXY COMPOUND, METHOD FOR PRODUCING THE SAME, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF

The present invention provides an epoxy compound which is 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene. Also, the present invention provides a method for producing [1,1′-binaphthalene]-2,2′,7,7′-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1′-binaphthalene]-2,2′,7,7′-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1′-binaphthalene]-2,2′,7,7′-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1′-binaphthalene]-2,2′,7,7′-tetraol or [1,1′-binaphthalene]-2,2′,7,7′-tetraol monohydrate with epihalohydrin.

Ion Channel Antagonists/Blockers and Uses Thereof

Provided are ion channel antagonists/blockers and uses thereof. Specifically, it provides the compounds of formula (I) or pharmaceutically acceptable salts, stereoisomers, solvates or prodrugs, preparation method therefor and application thereof. Definition of each group in the formula can be found in the specification for details. Provided is also pharmaceutical composition useful for treatment of heart disease and other ion channel related diseases.

##STR00001##

Ion Channel Antagonists/Blockers and Uses Thereof

Provided are ion channel antagonists/blockers and uses thereof. Specifically, it provides the compounds of formula (I) or pharmaceutically acceptable salts, stereoisomers, solvates or prodrugs, preparation method therefor and application thereof. Definition of each group in the formula can be found in the specification for details. Provided is also pharmaceutical composition useful for treatment of heart disease and other ion channel related diseases.

##STR00001##

Resist composition, method for forming resist pattern, and polyphenol compound used therein

The present invention is a compound represented by the following general formula (1). ##STR00001##

Resist composition, method for forming resist pattern, and polyphenol compound used therein

The present invention is a compound represented by the following general formula (1). ##STR00001##

CONDUCTIVE PASTE AND MULTILAYER BOARD USING THE SAME
20170358381 · 2017-12-14 ·

A conductive paste having a viscosity suitable for filling a hole of a board, long pot life, and excellent conductivity and long-term reliability of a cured product, and a multilayer board using the same are provided.

A conductive paste comprising with respect to (A) 100 parts by mass of dimer acid-modified epoxy resin, (B) from 200 to 1900 parts by mass of high melting metal powder containing silver-coated copper alloy powder and having a melting point of 800° C. or higher, (C) from 400 to 2200 parts by mass of silver-coated copper alloy powder having a melting point of 800° C. or higher, (D) from 1.0 to 20.0 parts by mass of curing agent containing a hydroxy group-containing aromatic compound, and (E) from 5.0 to 100.0 parts by mass of a flux containing polycarboxylic acid, is used as the present invention.

CONDUCTIVE PASTE AND MULTILAYER BOARD USING THE SAME
20170358381 · 2017-12-14 ·

A conductive paste having a viscosity suitable for filling a hole of a board, long pot life, and excellent conductivity and long-term reliability of a cured product, and a multilayer board using the same are provided.

A conductive paste comprising with respect to (A) 100 parts by mass of dimer acid-modified epoxy resin, (B) from 200 to 1900 parts by mass of high melting metal powder containing silver-coated copper alloy powder and having a melting point of 800° C. or higher, (C) from 400 to 2200 parts by mass of silver-coated copper alloy powder having a melting point of 800° C. or higher, (D) from 1.0 to 20.0 parts by mass of curing agent containing a hydroxy group-containing aromatic compound, and (E) from 5.0 to 100.0 parts by mass of a flux containing polycarboxylic acid, is used as the present invention.

CURABLE COMPOSITION FOR PERMANENT RESIST FILMS, AND PERMANENT RESIST FILM
20170349690 · 2017-12-07 ·

A curable composition and a permanent resist film made using this curable composition are provided. The composition dissolves well in solvents, gives coatings superior in alkali developability, thermal decomposition resistance, light sensitivity, and resolution, and is particularly suitable for the formation of permanent resist films. Specifically, the composition is a curable composition for permanent resist films and contains a phenolic hydroxyl-containing compound (A) that has a molecular structure represented by structural formula (1):

##STR00001##

(where R.sup.1 is hydrogen, alkyl, or aryl, and n is an integer of 2 to 10; R.sup.2 is alkyl, alkoxy, aryl, aralkyl, or halogen, and m is an integer of 0 to 4; if m is 2 or more, the plurality of R.sup.2s may be the same or different from one another, and may be bonded to either of the two aromatic rings in the naphthylene structure) and a photosensitizer (B1) or curing agent (B2).

PHENOLIC HYDROXYL-CONTAINING COMPOUND, COMPOSITION CONTAINING THE SAME, AND CURED FILM OF THE COMPOSITION
20170334817 · 2017-11-23 · ·

A phenolic hydroxyl-containing compound is provided. The compound dissolves well in solvents and can be formulated into compositions that give coatings superior in thermal decomposition resistance, alkali developability, resolution, and dry-etch resistance. Specifically, the compound is a phenolic hydroxyl-containing calixarene represented by structural formula (1):

##STR00001##

(where A is a structural unit including a dihydroxynaphthalene- or naphthol-derived structure optionally with a substituent alkyl, alkoxy, aryl, or aralkyl group or halogen atom on the aromatic rings and a methylene group optionally having an alkyl or aryl group in place of one of the hydrogen atoms) and obtained using a dihydroxynaphthalene in combination with a naphthol, with the total repeat number p being an integer of 2 to 10.