Patent classifications
C07C39/225
Resist composition, method for forming resist pattern, and polyphenol compound used therein
The present invention is a compound represented by the following general formula (1). ##STR00001##
Resist composition, method for forming resist pattern, and polyphenol compound used therein
The present invention is a compound represented by the following general formula (1). ##STR00001##
Menaquinol compositions and methods of treatment
The present application discloses methods for the efficient preparation of high purity compounds of the Formula I, and their methods of use. ##STR00001##
Menaquinol compositions and methods of treatment
The present application discloses methods for the efficient preparation of high purity compounds of the Formula I, and their methods of use. ##STR00001##
Menaquinol Compositions and Methods of Treatment
The present application discloses methods for the efficient preparation of high purity compounds of the Formula I, and their methods of use.
##STR00001##
MONOFUNCTIONAL PHENOLIC COMPOUND, ACTIVE ESTER RESIN AND METHOD FOR PRODUCING THE SAME, AND THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREOF
Provided are a monofunctional phenolic compound used for producing an active ester resin capable of forming a cured product having excellent dielectric properties and excellent heat resistance, an active ester resin and a method for producing the active ester resin, and a thermosetting resin composition and a cured product of the thermosetting resin composition. Specifically, provided are a monofunctional phenolic compound including one or more vinylbenzyl groups and an active ester resin including a vinylbenzyl structure attached to a terminal group of the molecular chain and derived from the monofunctional phenolic compound. The vinylbenzyl structure preferably includes a vinylbenzyl-modified aryloxycarbonyl group.
MONOFUNCTIONAL PHENOLIC COMPOUND, ACTIVE ESTER RESIN AND METHOD FOR PRODUCING THE SAME, AND THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREOF
Provided are a monofunctional phenolic compound used for producing an active ester resin capable of forming a cured product having excellent dielectric properties and excellent heat resistance, an active ester resin and a method for producing the active ester resin, and a thermosetting resin composition and a cured product of the thermosetting resin composition. Specifically, provided are a monofunctional phenolic compound including one or more vinylbenzyl groups and an active ester resin including a vinylbenzyl structure attached to a terminal group of the molecular chain and derived from the monofunctional phenolic compound. The vinylbenzyl structure preferably includes a vinylbenzyl-modified aryloxycarbonyl group.
Monomer for a hardmask composition, hardmask composition comprising the monomer, and method for forming a pattern using the hardmask composition
Disclosed are a monomer for a hardmask composition represented by the following Chemical Formula 1, a hardmask composition including the monomer, and a method of forming a pattern using the same. ##STR00001##
In Chemical Formula 1, A, A′, L and n are the same as in the detailed description.
Monomer for a hardmask composition, hardmask composition comprising the monomer, and method for forming a pattern using the hardmask composition
Disclosed are a monomer for a hardmask composition represented by the following Chemical Formula 1, a hardmask composition including the monomer, and a method of forming a pattern using the same. ##STR00001##
In Chemical Formula 1, A, A′, L and n are the same as in the detailed description.
Polycarbonate resin composition, molded article, polycarbonate resin, and end-capping agent for polycarbonate resin
A polycarbonate resin composition, a molded article, a polycarbonate resin, and an end-capping agent for polycarbonate resins are provided. The polycarbonate resin composition contains: a polycarbonate resin having a terminal structure represented by Formula (A) and having a viscosity average molecular weight from 1×10.sup.4 to 5×10.sup.4, and a stabilizer. In Formula (A), R.sup.1 is selected from the group consisting of a hydrogen atom, halogen atoms, linear alkyl groups having from 1 to 9 carbons, branched alkyl groups having from 3 to 9 carbons, linear alkenyl groups having from 2 to 9 carbons, branched alkenyl groups having from 3 to 9 carbons, and aryl groups having from 6 to 12 carbons; and R.sup.2 to R.sup.7 are each independently selected from the group consisting of a hydrogen atom, alkyl groups having from 1 to 9 carbons, and alkoxy groups having from 1 to 9 carbons. ##STR00001##