Patent classifications
C07D233/08
COMPOSITIONS AND METHODS FOR THE TREATMENT OF ANAL AND RECTAL DISORDERS
The present invention relates to compounds or its pharmaceutical acceptable polymorphs, solvates, enantiomers, stereoisomers, prodrugs, hydrates and or derivatives thereof. The Pharmaceutical composition comprises an effective amount of compounds of formula I, formula II, formula III, formula IV, Formula V, formula VI or formula VII and the methods of using the composition for treating disorder affecting the anus and rectum. The composition can be formulated for oral administration, rectal administration, topical administration, transmucosal, transdermal administration, spray, injection or other known formulation in the art.
COMPOSITIONS AND METHODS FOR THE TREATMENT OF ANAL AND RECTAL DISORDERS
The present invention relates to compounds or its pharmaceutical acceptable polymorphs, solvates, enantiomers, stereoisomers, prodrugs, hydrates and or derivatives thereof. The Pharmaceutical composition comprises an effective amount of compounds of formula I, formula II, formula III, formula IV, Formula V, formula VI or formula VII and the methods of using the composition for treating disorder affecting the anus and rectum. The composition can be formulated for oral administration, rectal administration, topical administration, transmucosal, transdermal administration, spray, injection or other known formulation in the art.
Cobalt complexes, process for preparation and use thereof
The present invention discloses a cobalt compound of formula (I), a process for the preparation and use thereof. The present invention further relates to a pharmaceutical composition and a method inhibition of Tau Aggregation in a subject in need thereof using compound of formula (I). ##STR00001##
SUBSTITUTED BENZAMIDES AND METHODS OF USE THEREOF
- Jean-Christophe Andrez ,
- Paul Robert Bichler ,
- Chien-An CHEN ,
- Sultan Chowdhury ,
- Shannon Marie Decker ,
- Christoph Martin Dehnhardt ,
- Thilo Focken ,
- Michael Edward Grimwood ,
- Ivan William HEMEON ,
- Qi Jia ,
- Jun LI ,
- Zhiguo Liu ,
- Daniel F. ORTWINE ,
- Brian Salvatore Safina ,
- Daniel SUTHERLIN ,
- Tao SHENG ,
- Shaoyi Sun ,
- Andrew D. WHITE ,
- Michael Scott Wilson ,
- Alla Yurevna Zenova ,
- Jiuxiang Zhu
The invention provides compounds having the general formula I:
##STR00001##
and pharmaceutically acceptable salts thereof, wherein the variables R.sup.A, R.sup.AA, subscript n, ring A, X.sup.2, L, subscript m, X.sup.1, R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.N have the meaning as described herein, and compositions containing such compounds and methods for using such compounds and compositions.
ANTIMICROBIAL PHENOLIC FATTY ACID-BASED EPOXY CURING AGENTS FOR EPOXIES
Compositions containing at least one compound of formula I
##STR00001##
where R1 is a phenolic compound (e.g., simple phenol, creosote, thymol, or carvacrol), and where R2 is a polyamine (e.g., ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), hexamethylenediamine (HDA)); and optionally a carrier; the compositions may additionally contain at least one epoxy resin. Methods for killing microorganisms involving contacting the microorganisms with an effective microorganism killing amount of the above composition. Compositions containing at least one compound produced by a method involving reacting phenolic-branched chain fatty acid methyl ester with at least one polyamine.
ANTIMICROBIAL PHENOLIC FATTY ACID-BASED EPOXY CURING AGENTS FOR EPOXIES
Compositions containing at least one compound of formula I
##STR00001##
where R1 is a phenolic compound (e.g., simple phenol, creosote, thymol, or carvacrol), and where R2 is a polyamine (e.g., ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), hexamethylenediamine (HDA)); and optionally a carrier; the compositions may additionally contain at least one epoxy resin. Methods for killing microorganisms involving contacting the microorganisms with an effective microorganism killing amount of the above composition. Compositions containing at least one compound produced by a method involving reacting phenolic-branched chain fatty acid methyl ester with at least one polyamine.
COBALT COMPLEXES, PROCESS FOR PREPARATION AND USE THEREOF
The present invention discloses a cobalt compound of formula (I), a process for the preparation and use thereof. The present invention further relates to a pharmaceutical composition and a method inhibition of Tau Aggregation in a subject in need thereof using compound of formula (I).
##STR00001##
ANTIMICROBIAL PHENOLIC FATTY ACID-BASED EPOXY CURING AGENTS FOR POLYMERS
Composition and methods for killing microorganisms using antimicrobial epoxy polymers and epoxy polymer curing agents are described.
Compositions containing at least one compound of formula I
##STR00001## where R1 is a phenolic group (e.g., simple phenol, creosote, thymol, or carvacrol), and where R2 is a polyamine (e.g., ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), hexamethylenediamine (HDA)); and optionally a carrier; the compositions may additionally contain at least one epoxy resin. Methods for killing microorganisms involving contacting the microorganisms with an effective microorganism killing amount of the above composition.
ANTIMICROBIAL PHENOLIC FATTY ACID-BASED EPOXY CURING AGENTS FOR POLYMERS
Composition and methods for killing microorganisms using antimicrobial epoxy polymers and epoxy polymer curing agents are described.
Compositions containing at least one compound of formula I
##STR00001## where R1 is a phenolic group (e.g., simple phenol, creosote, thymol, or carvacrol), and where R2 is a polyamine (e.g., ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), hexamethylenediamine (HDA)); and optionally a carrier; the compositions may additionally contain at least one epoxy resin. Methods for killing microorganisms involving contacting the microorganisms with an effective microorganism killing amount of the above composition.
Antimicrobial phenolic fatty acid-based epoxy curing agents for epoxies
Compositions containing at least one compound of formula I ##STR00001## where R1 is a phenolic compound (e.g., simple phenol, creosote, thymol, or carvacrol), and where R2 is a polyamine (e.g., ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), hexamethylenediamine (HDA)); and optionally a carrier; the compositions may additionally contain at least one epoxy resin. Methods for killing microorganisms involving contacting the microorganisms with an effective microorganism killing amount of the above composition. Compositions containing at least one compound produced by a method involving reacting phenolic-branched chain fatty acid methyl ester with at least one polyamine.