Disclosed are a tricyclic compound as represented by general formula (I), a pharmaceutical composition containing same, and a preparation method therefor and the medical use thereof. The compound can be used for preventing and treating a variety of diseases caused by toxic aldehydes.

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Disclosed are a tricyclic compound as represented by general formula (I), a pharmaceutical composition containing same, and a preparation method therefor and the medical use thereof. The compound can be used for preventing and treating a variety of diseases caused by toxic aldehydes.

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Provided are a condensed cyclic compound having the following structure: ##STR00001##
wherein ring D.sub.1 and ring D.sub.2 are each independently a C.sub.6-C.sub.20 aromatic ring, and an organic light-emitting device including the same.

Provided are a condensed cyclic compound having the following structure: ##STR00001##
wherein ring D.sub.1 and ring D.sub.2 are each independently a C.sub.6-C.sub.20 aromatic ring, and an organic light-emitting device including the same.

The application discloses an organic compound, an electronic element with the organic compound, and an electronic device including the electronic element. The organic compound of the present application has a fused heteroaromatic group containing fluorenyl or silylfluorenyl as its core structure, which presents a large planar structure in a three-dimensional (3D) space; and an electron-rich arylamine or heteroarylamine substituent is introduced at position 9 of the fluorenyl or silylfluorenyl to make the compound have excellent hole transport performance.

The application discloses an organic compound, an electronic element with the organic compound, and an electronic device including the electronic element. The organic compound of the present application has a fused heteroaromatic group containing fluorenyl or silylfluorenyl as its core structure, which presents a large planar structure in a three-dimensional (3D) space; and an electron-rich arylamine or heteroarylamine substituent is introduced at position 9 of the fluorenyl or silylfluorenyl to make the compound have excellent hole transport performance.

The application discloses an organic compound, an electronic element with the organic compound, and an electronic device including the electronic element. The organic compound of the present application has a fused heteroaromatic group containing fluorenyl or silylfluorenyl as its core structure, which presents a large planar structure in a three-dimensional (3D) space; and an electron-rich arylamine or heteroarylamine substituent is introduced at position 9 of the fluorenyl or silylfluorenyl to make the compound have excellent hole transport performance.

The application discloses an organic compound, an electronic element with the organic compound, and an electronic device including the electronic element. The organic compound of the present application has a fused heteroaromatic group containing fluorenyl or silylfluorenyl as its core structure, which presents a large planar structure in a three-dimensional (3D) space; and an electron-rich arylamine or heteroarylamine substituent is introduced at position 9 of the fluorenyl or silylfluorenyl to make the compound have excellent hole transport performance.

The present invention is a material for forming an organic film, containing: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, where Wi represents a tetravalent or hexavalent organic group, n1 represents an integer of 1 or 2, n2 represents 2 or 3, each R.sub.1 independently represents any in the following formula (1B), and a hydrogen atom of a benzene ring in the formula (1A) is optionally substituted with a fluorine atom. This provides: a compound having a dioxin structure, which is cured even under film formation conditions in inert gas, and which is capable of forming an organic underlayer film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable film formability and adhesiveness to a substrate; and an organic film material containing the compound.

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The present invention is a material for forming an organic film, containing: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, where Wi represents a tetravalent or hexavalent organic group, n1 represents an integer of 1 or 2, n2 represents 2 or 3, each R.sub.1 independently represents any in the following formula (1B), and a hydrogen atom of a benzene ring in the formula (1A) is optionally substituted with a fluorine atom. This provides: a compound having a dioxin structure, which is cured even under film formation conditions in inert gas, and which is capable of forming an organic underlayer film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable film formability and adhesiveness to a substrate; and an organic film material containing the compound.

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