C08F12/36

Inorganic nanoparticle-coated hollow particles, method for producing the same, and aqueous dispersion containing the hollow particles
11707722 · 2023-07-25 · ·

Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.

Inorganic nanoparticle-coated hollow particles, method for producing the same, and aqueous dispersion containing the hollow particles
11707722 · 2023-07-25 · ·

Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.

Component addition polymerization

Provided is a collection of polymeric beads, wherein the beads comprise (i) 75 to 99% by weight, based on the weight of the bead, polymerized units of monofunctional vinyl monomer, and (ii) 1 to 25% by weight, based on the weight of the bead, polymerized units of multifunctional vinyl monomer; wherein, within each bead, the average concentration of moles of polymerized units of multifunctional vinyl monomer per cubic micrometer is MVAV; wherein, within each bead, T1000 is a sequence of 1,000 unique connected polymerized monomer units; wherein, within each T1000, MVSEQ is the weight percent polymerized units of multifunctional vinyl monomer, based on the weight of T1000; wherein MVRATIO=MVSEQ/MVAV; and wherein 90% or more of the beads by volume are uniform beads, wherein a uniform bead is a bead in which 90% or more of all T1000 sequences has MVRATIO of 1.5 or less.

Component addition polymerization

Provided is a collection of polymeric beads, wherein the beads comprise (i) 75 to 99% by weight, based on the weight of the bead, polymerized units of monofunctional vinyl monomer, and (ii) 1 to 25% by weight, based on the weight of the bead, polymerized units of multifunctional vinyl monomer; wherein, within each bead, the average concentration of moles of polymerized units of multifunctional vinyl monomer per cubic micrometer is MVAV; wherein, within each bead, T1000 is a sequence of 1,000 unique connected polymerized monomer units; wherein, within each T1000, MVSEQ is the weight percent polymerized units of multifunctional vinyl monomer, based on the weight of T1000; wherein MVRATIO=MVSEQ/MVAV; and wherein 90% or more of the beads by volume are uniform beads, wherein a uniform bead is a bead in which 90% or more of all T1000 sequences has MVRATIO of 1.5 or less.

ORGANICALLY MODIFIED CHALCOGENIDE POLYMERS

A polymer comprising one or more chalcogenide elements and one or more crosslinking moieties. The crosslinking moieties may be organic, inorganic, or both. Also disclosed is the related method for making a polymer comprising purifying a chalcogenide polymer powder comprising one or more chalcogenide elements, melting the purified chalcogenide polymer powder, adding one or more crosslinking moieties to the melted chalcogenide polymer, and curing the modified chalcogenide polymer at a temperature between 150 and 200° C.

ORGANICALLY MODIFIED CHALCOGENIDE POLYMERS

A polymer comprising one or more chalcogenide elements and one or more crosslinking moieties. The crosslinking moieties may be organic, inorganic, or both. Also disclosed is the related method for making a polymer comprising purifying a chalcogenide polymer powder comprising one or more chalcogenide elements, melting the purified chalcogenide polymer powder, adding one or more crosslinking moieties to the melted chalcogenide polymer, and curing the modified chalcogenide polymer at a temperature between 150 and 200° C.

ORGANICALLY MODIFIED CHALCOGENIDE POLYMERS

A polymer comprising one or more chalcogenide elements and one or more crosslinking moieties. The crosslinking moieties may be organic, inorganic, or both. Also disclosed is the related method for making a polymer comprising purifying a chalcogenide polymer powder comprising one or more chalcogenide elements, melting the purified chalcogenide polymer powder, adding one or more crosslinking moieties to the melted chalcogenide polymer, and curing the modified chalcogenide polymer at a temperature between 150 and 200° C.

CNSL-based hydrocarbon resins, preparation and uses thereof

The present invention is directed to resins made from cashew nutshell liquid and vinyl hydrocarbons and processes for manufacturing the resins. These resins exhibit lower viscosity than the phenol-based homologs. They also exhibit good compatibility with a wide range of solvents, mineral and natural oils, epoxy curing agents, liquid epoxy resins, and polymers, which make them suitable additives as non-reactive diluents for solvent-free coating formulations; tackifiers for structural adhesive, pressure sensitive and hot-melt adhesives; stabilizers for lubricants, fuel and polymer formulations; plasticizers for thermoplastic polymers and processing aid for rubber compounding and stabilizers for respective rubber artifacts. These resins are also valuable precursors for the manufacture of epoxy resins and polyols for coating, adhesive and composite omulations exhibiting ameliorated performance in water repellency, anti-corrosion, and fast hardness development during cure.

CNSL-based hydrocarbon resins, preparation and uses thereof

The present invention is directed to resins made from cashew nutshell liquid and vinyl hydrocarbons and processes for manufacturing the resins. These resins exhibit lower viscosity than the phenol-based homologs. They also exhibit good compatibility with a wide range of solvents, mineral and natural oils, epoxy curing agents, liquid epoxy resins, and polymers, which make them suitable additives as non-reactive diluents for solvent-free coating formulations; tackifiers for structural adhesive, pressure sensitive and hot-melt adhesives; stabilizers for lubricants, fuel and polymer formulations; plasticizers for thermoplastic polymers and processing aid for rubber compounding and stabilizers for respective rubber artifacts. These resins are also valuable precursors for the manufacture of epoxy resins and polyols for coating, adhesive and composite omulations exhibiting ameliorated performance in water repellency, anti-corrosion, and fast hardness development during cure.

Resin composition, dry-etching resist mask, and patterning method
09777079 · 2017-10-03 · ·

Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.