A method of forming a photoresist pattern and a semiconductor device on which a photoresist pattern manufactured according to the same is formed. The method includes forming a photoresist pattern on a substrate; coating an organic topcoat composition including an acrylic polymer including a structural unit containing a hydroxy group and a fluorine and an acidic compound on the photoresist pattern; drying and heating the substrate on which the organic topcoat composition is coated to coat it with a topcoat; and spraying a rinse solution including an ether-based compound on the substrate coated with the topcoat to remove the topcoat.

A method for forming photoresist patterns and a semiconductor device on which a photoresist pattern manufactured according to the method is formed are disclosed. The method includes forming a preliminary photoresist pattern on a substrate; coating an organic topcoat composition including an acrylic polymer, the acrylic polymer including a structural unit containing a hydroxy group and a fluorine, and an acid compound on the preliminary photoresist pattern; drying and heating the substrate on which the organic topcoat composition is coated to coat it with a topcoat; and spraying a rinse solution including an acetate-based compound on the substrate coated with the topcoat to remove the topcoat.

The present invention is directed to a purification method for purifying a fluorine-containing polymerizable monomer of the formula (1), in which the fluorine-containing polymerizable monomer is purified by distillation in the coexistence of a phenolic compound A such as 6-tert-butyl-2,4-xylenol and a phenolic compound B such as 2,2′-methylene-bis(4-methyl-6-tert-butylphenol). ##STR00001##
By the combined use of the phenolic compound A and the phenolic compound B, it is possible to significantly suppress polymerization or oligomerization of the fluorine-containing polymerizable monomer even during industrial-production-scale distillation and efficiently purify the fluorine-containing polymerizable monomer by distillation.

The present invention relates to a technology of solving an issue where screens are contaminated with pollution caused by fingerprints, cosmetics, etc. on covers or windows of mobile devices such as smartphones, tablets, etc. and other user contact devices, thereby maintaining the excellent surface hardness properties of existing covers or windows and preventing deterioration of surface properties (antifouling properties) even when used long-term. The method for forming a surface having super water-repellent and super oil-repellent properties comprises the steps of: etching a surface of a target on which a surface with super water-repellent and super oil-repellent properties will be formed, to thereby form a surface structure in which convex parts () and concave parts () are continuously formed; and performing a conformal coating for coating a fluorine-based material on the surface structure which is etched on the surface of the target, wherein all configuration walls of the convex parts and all configuration walls of the concave parts are coated at a uniform thickness.

The present invention relates to a technology of solving an issue where screens are contaminated with pollution caused by fingerprints, cosmetics, etc. on covers or windows of mobile devices such as smartphones, tablets, etc. and other user contact devices, thereby maintaining the excellent surface hardness properties of existing covers or windows and preventing deterioration of surface properties (antifouling properties) even when used long-term. The method for forming a surface having super water-repellent and super oil-repellent properties comprises the steps of: etching a surface of a target on which a surface with super water-repellent and super oil-repellent properties will be formed, to thereby form a surface structure in which convex parts () and concave parts () are continuously formed; and performing a conformal coating for coating a fluorine-based material on the surface structure which is etched on the surface of the target, wherein all configuration walls of the convex parts and all configuration walls of the concave parts are coated at a uniform thickness.

The invention provides powerful methods and compositions for designing, selecting, fine-tuning and optimizing polymer nanogel and other supramolecular assemblies for various properties including, for example, particle size, density and morphology, guest loading capacity and encapsulation stability, and dynamic release control.

A curable composition containing at least one of a haloalkyl ether (meth)acrylate or a haloalkenyl ether (meth)acrylate and, optionally, one or more different types of co-monomers is cured to provide a polymer having advantageous properties as a result of the incorporation of halogenated functionality derived from the haloalkyl/haloalkenyl ether (meth)acrylate monomer.

A functional polymer including at least two different types of side chains, having the general formula (1),

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wherein A is an at least monosubstituted alkylene or arylene group; B is an amide, ester or ether group and n is 0 or 1; F is selected from: an ester, secondary amine, amide, ether, thio ether, thio ester, and may be the same or different for the different side chains; D is a side chain intended to reversible bind to a substrate or has a coating function; E is a side chain intended to irreversible bind to a substrate, the side chain E and polymer includes 1 to 10 different side chains D and 1 to 10 different side chains E, but at least one of each, and includes a plurality of each type, whereby the different types of side chains are randomly or regularly distributed in the polymer.

A cleaning composition for a semiconductor substrate contains a solvent, and a polymer that includes a fluorine atom, a silicon atom or a combination thereof. The content of water in the solvent is preferably no greater than 20% by mass. The cleaning composition preferably further contains an organic acid which is a non-polymeric acid. The organic acid is preferably a polyhydric carboxylic acid. The acid dissociation constant of the polymer is preferably less than that of the organic acid. The solubility of the organic acid in water at 25° C. is preferably no less than 5% by mass. The organic acid is preferably a solid at 25° C.

A cleaning composition for a semiconductor substrate contains a solvent, and a polymer that includes a fluorine atom, a silicon atom or a combination thereof. The content of water in the solvent is preferably no greater than 20% by mass. The cleaning composition preferably further contains an organic acid which is a non-polymeric acid. The organic acid is preferably a polyhydric carboxylic acid. The acid dissociation constant of the polymer is preferably less than that of the organic acid. The solubility of the organic acid in water at 25° C. is preferably no less than 5% by mass. The organic acid is preferably a solid at 25° C.