Patent classifications
C08F20/08
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE SHEET, CURED FILM, METHOD FOR PRODUCING CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND DISPLAY DEVICE
The purpose of the present invention is to provide a photosensitive resin composition that yields a cured film having exceptional heat resistance, elongation, chemical resistance, permittivity, and dielectric tangent while being curable under low-temperature heat treatments, the percentage of film remaining after development being exceptional. To solve the above problem, the photosensitive resin composition of the present invention has the following configuration. Specifically, a photosensitive resin composition that contains a resin (A) and a photopolymerization initiator (B), said resin (A): containing one or more structural units selected from the group consisting of specific structural units represented by formula (1), formula (3), and formula (5); and also containing one or more structural units selected from the group consisting of structural units represented by formula (2), formula (4), and formula (6).
Thermoplastic resin composition, molded object, and production methods therefor
A thermoplastic resin composition, a molded body, and first and second production methods are disclosed. The thermoplastic resin composition contains a polyolefin resin, a polyamide resin, and a modified elastomer and shows non-Newtonian properties in a fluidized state. The molded body includes the thermoplastic resin composition. The first production method includes molding the thermoplastic resin composition at a shear rate of 80 sec.sup.−1 or more and a standby step in which resin composition is on standby at a shear rate of 0 sec.sup.−1 or more but less than 80 sec.sup.−1. The second production method includes molding the resin composition at a shear rate X.sub.1 to obtain part of a molded body and molding the resin composition at a shear rate X.sub.2 to obtain another part of the molded body, wherein an absolute value of a difference between X.sub.1 and X.sub.2 is 200 sec.sup.−1 or more.
Thermoplastic resin composition, molded object, and production methods therefor
A thermoplastic resin composition, a molded body, and first and second production methods are disclosed. The thermoplastic resin composition contains a polyolefin resin, a polyamide resin, and a modified elastomer and shows non-Newtonian properties in a fluidized state. The molded body includes the thermoplastic resin composition. The first production method includes molding the thermoplastic resin composition at a shear rate of 80 sec.sup.−1 or more and a standby step in which resin composition is on standby at a shear rate of 0 sec.sup.−1 or more but less than 80 sec.sup.−1. The second production method includes molding the resin composition at a shear rate X.sub.1 to obtain part of a molded body and molding the resin composition at a shear rate X.sub.2 to obtain another part of the molded body, wherein an absolute value of a difference between X.sub.1 and X.sub.2 is 200 sec.sup.−1 or more.
Friable shell microcapsules, process for preparing the same and method of use thereof
The present application describes a microcapsule comprising: (i) a lipophilic core material, and (ii) a microcapsule shell, wherein microcapsule shell formed from oil-in-water emulsion polymerisation of monomer mixture consisting essentially of: (a) greater than 70 to about 99% by weight of at least one polyfunctional ethylenically unsaturated monomer, (b) about 1 to about 30% by weight of at least one unsaturated carboxylic acid monomer or its ester, and (c) about 0 to about 30% by weight of at least one vinyl monomer. Also provides process for preparing the same and its method of use in various applications.
Friable shell microcapsules, process for preparing the same and method of use thereof
The present application describes a microcapsule comprising: (i) a lipophilic core material, and (ii) a microcapsule shell, wherein microcapsule shell formed from oil-in-water emulsion polymerisation of monomer mixture consisting essentially of: (a) greater than 70 to about 99% by weight of at least one polyfunctional ethylenically unsaturated monomer, (b) about 1 to about 30% by weight of at least one unsaturated carboxylic acid monomer or its ester, and (c) about 0 to about 30% by weight of at least one vinyl monomer. Also provides process for preparing the same and its method of use in various applications.
Process for cross-linked polyethylene production
A method of producing a silane cross-linked polyethylene is disclosed which includes maleating a polyethylene polymer to form a maleated polyethylene and reacting the maleated polyethylene with a primary or secondary amino silane to form a silane-grafted polyethylene. The method further includes treating the silane-grafted polyethylene in a moisture curing process to form the silane cross-linked polyethylene.
Process for cross-linked polyethylene production
A method of producing a silane cross-linked polyethylene is disclosed which includes maleating a polyethylene polymer to form a maleated polyethylene and reacting the maleated polyethylene with a primary or secondary amino silane to form a silane-grafted polyethylene. The method further includes treating the silane-grafted polyethylene in a moisture curing process to form the silane cross-linked polyethylene.
MOISTURE RESISTANCE IMPROVER FOR WATER-BASED ADHESIVE FOR INORGANIC MATERIALS, AND WATER-BASED ADHESIVE FOR INORGANIC MATERIALS
Provided are a moisture resistance improver that yields a water-based adhesive for inorganic materials having exceptional adhesiveness of inorganic materials, and a water-based adhesive for inorganic materials in which the moisture resistance improver is used. The present invention is a moisture resistance improver (J) for a water-based adhesive for inorganic materials containing at least one (co)polymer (A) selected from the group consisting of (co)polymer (A1) and (co)polymer (A2). (Co)polymer (A1): a (co)polymer having a weight-average molecular weight of 3,000-150,000, and containing, as structural monomers, a C3-30 unsaturated (poly)carboxylic acid (anhydride) (a1) and a (meth)acrylic acid ester (a2) having solubility of 10 g or less per 100 g of water at 25° C. (Co)polymer (A2): a (co)polymer having a weight-average molecular weight of 6,000-150,000, and containing the above unsaturated (poly)carboxylic acid (anhydride) (a1) as a structural monomer but not containing the above (meth)acrylic acid ester (a2) as a structural monomer.
MOISTURE RESISTANCE IMPROVER FOR WATER-BASED ADHESIVE FOR INORGANIC MATERIALS, AND WATER-BASED ADHESIVE FOR INORGANIC MATERIALS
Provided are a moisture resistance improver that yields a water-based adhesive for inorganic materials having exceptional adhesiveness of inorganic materials, and a water-based adhesive for inorganic materials in which the moisture resistance improver is used. The present invention is a moisture resistance improver (J) for a water-based adhesive for inorganic materials containing at least one (co)polymer (A) selected from the group consisting of (co)polymer (A1) and (co)polymer (A2). (Co)polymer (A1): a (co)polymer having a weight-average molecular weight of 3,000-150,000, and containing, as structural monomers, a C3-30 unsaturated (poly)carboxylic acid (anhydride) (a1) and a (meth)acrylic acid ester (a2) having solubility of 10 g or less per 100 g of water at 25° C. (Co)polymer (A2): a (co)polymer having a weight-average molecular weight of 6,000-150,000, and containing the above unsaturated (poly)carboxylic acid (anhydride) (a1) as a structural monomer but not containing the above (meth)acrylic acid ester (a2) as a structural monomer.
THERMOPLASTIC RESIN COMPOSITION, MOLDED OBJECT, AND PRODUCTION METHODS THEREFOR
A thermoplastic resin composition, a molded body, and first and second production methods are disclosed. The thermoplastic resin composition contains a polyolefin resin, a polyamide resin, and a modified elastomer and shows non-Newtonian properties in a fluidized state. The molded body includes the thermoplastic resin composition. The first production method includes molding the thermoplastic resin composition at a shear rate of 80 sec.sup.1 or more and a standby step in which resin composition is on standby at a shear rate of 0 sec.sup.1 or more but less than 80 sec.sup.1. The second production method includes molding the resin composition at a shear rate X.sub.1 to obtain part of a molded body and molding the resin composition at a shear rate X.sub.2 to obtain another part of the molded body, wherein an absolute value of a difference between X.sub.1 and X.sub.2 is 200 sec.sup.1 or more.