The present invention relates to novel compounds, particularly to compounds comprising a photoactive unit, said novel compounds being particularly suitable for ophthalmic devices as well as to ophthalmic devices comprising such compounds.

A film touch sensor is prepared by performing a process in which a separation layer made of a specific component is formed on a carrier substrate, and an insulation film is formed on a transparent conductive film pattern, which is used as a planarization layer, an adhesive layer or a base layer.

A film touch sensor is prepared by performing a process in which a separation layer made of a specific component is formed on a carrier substrate, and an insulation film is formed on a transparent conductive film pattern, which is used as a planarization layer, an adhesive layer or a base layer.

Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.

Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.

The present invention is a liquid crystal display device including a liquid crystal layer containing a liquid crystal material, a sealing member surrounding the liquid crystal layer in a plan view, a pair of substrates sandwiching the liquid crystal layer, and an alignment control layer being in contact with the liquid crystal layer in a region surrounded by the sealing member in a plan view. The alignment control layer aligns a liquid crystal compound in the liquid crystal material in a direction horizontal to faces of the substrates, and contains a polymer formed by polymerization of at least one monomer, and the at least one monomer contains a monomer represented by the following Chemical formula (1): ##STR00001##
wherein at least one hydrogen atom of the phenylene group may be the same or different and may be substituted with a halogen atom, a methyl group, an ethyl group, or a propyl group.

To provide a curable composition that is readily modeled with low viscosity and excellent curing capability in modeling by stereolithography, and provides a cured article excellent in toughness and water resistance, and a resin composition for stereolithography prepared therefrom. To provide a resin composition for stereolithography that is favorable particularly for a dental mouthpiece and a denture base material. A curable composition containing 79.0 to 99.0% by mass of a polymerizable monomer (a), 0.1 to 10.0% by mass of a photopolymerization initiator (b), and 0.01 to 20.0% by mass of a compound (c) represented by the following general formula (I): ##STR00001##

To provide a curable composition that is readily modeled with low viscosity and excellent curing capability in modeling by stereolithography, and provides a cured article excellent in toughness and water resistance, and a resin composition for stereolithography prepared therefrom. To provide a resin composition for stereolithography that is favorable particularly for a dental mouthpiece and a denture base material. A curable composition containing 79.0 to 99.0% by mass of a polymerizable monomer (a), 0.1 to 10.0% by mass of a photopolymerization initiator (b), and 0.01 to 20.0% by mass of a compound (c) represented by the following general formula (I): ##STR00001##

To provide a curable composition that is readily modeled with low viscosity and excellent curing capability in modeling by stereolithography, and provides a cured article excellent in toughness and water resistance, and a resin composition for stereolithography prepared therefrom. To provide a resin composition for stereolithography that is favorable particularly for a dental mouthpiece and a denture base material. A curable composition containing 79.0 to 99.0% by mass of a polymerizable monomer (a), 0.1 to 10.0% by mass of a photopolymerization initiator (b), and 0.01 to 20.0% by mass of a compound (c) represented by the following general formula (I):

##STR00001##

To provide a curable composition that is readily modeled with low viscosity and excellent curing capability in modeling by stereolithography, and provides a cured article excellent in toughness and water resistance, and a resin composition for stereolithography prepared therefrom. To provide a resin composition for stereolithography that is favorable particularly for a dental mouthpiece and a denture base material. A curable composition containing 79.0 to 99.0% by mass of a polymerizable monomer (a), 0.1 to 10.0% by mass of a photopolymerization initiator (b), and 0.01 to 20.0% by mass of a compound (c) represented by the following general formula (I):

##STR00001##