The polymerization stability and the chemical stability and the water resistance of resin films are improved. A surfactant composition according to an embodiment contains a surfactant (A) represented by general formula (1) and an anionic surfactant (B) having a hydrophobic group different from that of the surfactant (A). In the formula, R.sup.1 represents one or two groups selected from groups below, D.sup.1 represents a polymerizable unsaturated group represented by chemical formula D.sup.1-1 or D.sup.1-2 below, R.sup.2 represents a hydrogen atom or a methyl group, m1 and m2 represent 1 to 2, A.sup.1 represents an alkylene group with 2 to 4 carbon atoms, and m3 represents 1 to 100. ##STR00001##

The polymerization stability and the chemical stability and the water resistance of resin films are improved. A surfactant composition according to an embodiment contains a surfactant (A) represented by general formula (1) and an anionic surfactant (B) having a hydrophobic group different from that of the surfactant (A). In the formula, R.sup.1 represents one or two groups selected from groups below, D.sup.1 represents a polymerizable unsaturated group represented by chemical formula D.sup.1-1 or D.sup.1-2 below, R.sup.2 represents a hydrogen atom or a methyl group, m1 and m2 represent 1 to 2, A.sup.1 represents an alkylene group with 2 to 4 carbon atoms, and m3 represents 1 to 100. ##STR00001##

The present invention is directed to resins made from cashew nutshell liquid and vinyl hydrocarbons and processes for manufacturing the resins. These resins exhibit lower viscosity than the phenol-based homologs. They also exhibit good compatibility with a wide range of solvents, mineral and natural oils, epoxy curing agents, liquid epoxy resins, and polymers, which make them suitable additives as non-reactive diluents for solvent-free coating formulations; tackifiers for structural adhesive, pressure sensitive and hot-melt adhesives; stabilizers for lubricants, fuel and polymer formulations; plasticizers for thermoplastic polymers and processing aid for rubber compounding and stabilizers for respective rubber artifacts. These resins are also valuable precursors for the manufacture of epoxy resins and polyols for coating, adhesive and composite omulations exhibiting ameliorated performance in water repellency, anti-corrosion, and fast hardness development during cure.

The present invention is directed to resins made from cashew nutshell liquid and vinyl hydrocarbons and processes for manufacturing the resins. These resins exhibit lower viscosity than the phenol-based homologs. They also exhibit good compatibility with a wide range of solvents, mineral and natural oils, epoxy curing agents, liquid epoxy resins, and polymers, which make them suitable additives as non-reactive diluents for solvent-free coating formulations; tackifiers for structural adhesive, pressure sensitive and hot-melt adhesives; stabilizers for lubricants, fuel and polymer formulations; plasticizers for thermoplastic polymers and processing aid for rubber compounding and stabilizers for respective rubber artifacts. These resins are also valuable precursors for the manufacture of epoxy resins and polyols for coating, adhesive and composite omulations exhibiting ameliorated performance in water repellency, anti-corrosion, and fast hardness development during cure.

A pattern forming process is provided comprising the steps of applying a resist composition comprising a polymer comprising recurring units having formula (1a) and/or (1b), an acid generator and a solvent onto a substrate, baking to form a resist film, exposing the resist film to high-energy radiation, baking, and developing in an alkaline developer to form a negative tone pattern.

A pattern forming process is provided comprising the steps of applying a resist composition comprising a polymer comprising recurring units having formula (1a) and/or (1b), an acid generator and a solvent onto a substrate, baking to form a resist film, exposing the resist film to high-energy radiation, baking, and developing in an alkaline developer to form a negative tone pattern.

A polymer comprising recurring units having an acid generator bound to the backbone, and recurring units having an optionally acid labile group-substituted carboxyl group and/or recurring units having an optionally acid labile group-substituted hydroxyl group is obtained by polymerizing corresponding monomers under such illumination that the quantity of light of wavelength up to 400 nm is up to 0.05 mW/cm.sup.2. The polymer avoids photo-decomposition of the acid generator during polymerization and concomitant deprotection reaction of the acid labile group when used in positive resist compositions. A pattern with high dissolution contrast and rectangularity is formed after development.

The present invention relates to a process for the preparation of a graft copolymer comprising a polyolefin main chain and one or multiple polymer side chains, the process comprising the steps of: copolymerizing at least one first type of olefin monomer and at least one second type of metal-pacified functionalized olefin monomer to obtain a polyolefin main chain having one or multiple metal-pacified functionalized short chain branches, and reacting the polyolefm main chain having one or multiple metal-pacified functionalized short chain branches with at least one metal substituting agent to obtain a polyolefin main chain having one or multiple functionalized short chain branches; and fonning one or multiple polymer side chains on the polyolefin main chain, wherein as initiators the functionalized short chain branches on the polyolefin main chain are used to obtain the graft copolymer. The invention also relates to the products obtained therefrom.

A positive-type resist composition which generates an acid upon exposure and whose solubility in an alkali developing solution increases under the action of an acid, the composition including a base material component whose solubility in an alkali developing solution increases under the action of an acid; and a compound represented by the following general formula (m0): ##STR00001## Z.sup.01 to Z.sup.04 each independently represent a substituent having electron withdrawing properties, Rb.sup.21 and Rb.sup.22 each independently represent an alkyl group, an alicyclic hydrocarbon group which may have a substituent, or a hydroxyl group, Rb.sup.1 represents an aryl group which may have a substituent, an alkyl group, or an alkenyl group, n1 and n2 represent an integer of 0 to 3, and X0.sup.− represents an organic anion.

A positive-type resist composition which generates an acid upon exposure and whose solubility in an alkali developing solution increases under the action of an acid, the composition including a base material component whose solubility in an alkali developing solution increases under the action of an acid; and a compound represented by the following general formula (m0): ##STR00001## Z.sup.01 to Z.sup.04 each independently represent a substituent having electron withdrawing properties, Rb.sup.21 and Rb.sup.22 each independently represent an alkyl group, an alicyclic hydrocarbon group which may have a substituent, or a hydroxyl group, Rb.sup.1 represents an aryl group which may have a substituent, an alkyl group, or an alkenyl group, n1 and n2 represent an integer of 0 to 3, and X0.sup.− represents an organic anion.