A light-cured anti-slip structure includes an anti-slip layer fixed onto a substrate surface. The anti-slip layer is composed of the light-curing composite, wherein the light-curing composite includes 50 wt % to 100 wt % of photopolymer, 0.5 wt % to 20 wt % of photoinitiator, 5 wt % to 50 wt % of thermosetting polymer, less than or equal to 5 wt % of thermal curing initiator, which are mixed. The photoinitiator receives light energy to trigger a light-curing reaction of the photopolymer. Simultaneously the photoinitiator releases heat to activate the thermal curing initiator, the thermal curing initiator induces a curing reaction of the thermosetting polymer to form the anti-slip layer. The light-cured anti-slip structure provided by the present invention could be quickly cured on the substrate surface, and the manufacturing time and the cost of material could be significantly reduced. A manufacturing method of a light-cured anti-slip structure is provided as well.

A light-cured anti-slip structure includes an anti-slip layer fixed onto a substrate surface. The anti-slip layer is composed of the light-curing composite, wherein the light-curing composite includes 50 wt % to 100 wt % of photopolymer, 0.5 wt % to 20 wt % of photoinitiator, 5 wt % to 50 wt % of thermosetting polymer, less than or equal to 5 wt % of thermal curing initiator, which are mixed. The photoinitiator receives light energy to trigger a light-curing reaction of the photopolymer. Simultaneously the photoinitiator releases heat to activate the thermal curing initiator, the thermal curing initiator induces a curing reaction of the thermosetting polymer to form the anti-slip layer. The light-cured anti-slip structure provided by the present invention could be quickly cured on the substrate surface, and the manufacturing time and the cost of material could be significantly reduced. A manufacturing method of a light-cured anti-slip structure is provided as well.

The present invention is a resist material containing a base polymer and an acid generator, where the resist material contains, as the acid generator, a sulfonium salt or iodonium salt of a sulfonic acid bonded to a maleimide group. In a chemically amplified resist material in which an acid is used as a catalyst, it is desired to develop an acid generator that makes it possible to reduce LWR of line patterns and critical dimension uniformity (CDU) of hole patterns, and to improve sensitivity. For this purpose, it is necessary to reduce image blurs due to acid diffusion considerably. An object of the present invention is to provide: a resist material having high sensitivity and low CDU in both a positive resist material and a negative resist material; and a patterning process using the same.

The present invention is a resist material containing a base polymer and an acid generator, where the resist material contains, as the acid generator, a sulfonium salt or iodonium salt of a sulfonic acid bonded to a maleimide group. In a chemically amplified resist material in which an acid is used as a catalyst, it is desired to develop an acid generator that makes it possible to reduce LWR of line patterns and critical dimension uniformity (CDU) of hole patterns, and to improve sensitivity. For this purpose, it is necessary to reduce image blurs due to acid diffusion considerably. An object of the present invention is to provide: a resist material having high sensitivity and low CDU in both a positive resist material and a negative resist material; and a patterning process using the same.

The present invention provides a material for intraocular lens which has improved hydrolysis resistance. The material for intraocular lens according to the present invention is obtained by polymerizing a monomer composition comprising: a base monomer, a hydrophilic monomer, and a cross-likable monomer, wherein the base monomer comprises an aromatic ring-containing acrylate monomer and an alkoxyalkyl methacrylate monomer having an alkoxyalkyl group having four or less carbon atoms. A blending ratio on a molar basis of the methacrylate monomer with respect to the acrylate monomer in all the monomer components contained in the monomer composition is 0.25 to 1.00.

A chemically-amplified negative resist composition includes: (A) a quencher containing an onium salt shown by the following formula (A-1); (B) a base polymer containing repeating units shown by the following formulae (B1) and (B2); and (C) a photo-acid generator which generates an acid. Thus, the present invention provides: a negative resist composition which can form a favorable profile with high sensitivity and low LWR and CDU in a pattern; and a resist patterning process using the composition. ##STR00001##

A chemically-amplified negative resist composition includes: (A) a quencher containing an onium salt shown by the following formula (A-1); (B) a base polymer containing repeating units shown by the following formulae (B1) and (B2); and (C) a photo-acid generator which generates an acid. Thus, the present invention provides: a negative resist composition which can form a favorable profile with high sensitivity and low LWR and CDU in a pattern; and a resist patterning process using the composition. ##STR00001##

A photocurable resin composition which can improve adhesion between light transmitting members. The photocurable resin composition contains a monofunctional acrylic monomer having a heating residue of 85.0% or less after being heated at 60° C. for 30 minutes, a crosslinking agent, a photopolymerization initiator, and a softening agent composed of at least one of plasticizer and tackifier, and the heating residue after being heated at 60° C. for 30 minutes is less than 96.0%.

A photocurable resin composition which can improve adhesion between light transmitting members. The photocurable resin composition contains a monofunctional acrylic monomer having a heating residue of 85.0% or less after being heated at 60° C. for 30 minutes, a crosslinking agent, a photopolymerization initiator, and a softening agent composed of at least one of plasticizer and tackifier, and the heating residue after being heated at 60° C. for 30 minutes is less than 96.0%.

A photocurable composition for three-dimensional stereolithography which has a lower viscosity and from which a cured product having a high refractive index is obtained, and a three-dimensional object formed by using the composition. The composition is a photocurable composition for three-dimensional stereolithography containing a fluorene monomer, a carbazole monomer, a diluent monomer, and a photopolymerization initiator, the carbazole monomer being contained in an amount of less than 30 wt % with respect to the total amount of the fluorene monomer and the carbazole monomer, and the diluent monomer being contained in an amount of at least 20 wt % with respect to total solids.