A resin produced by a conventional technique has a weak nature in terms of hydrolysis resistance. For example, in a case where the resin produced by a conventional technique is used in an area with a highly humid climate such as Japan for a long period of time, deterioration of the resin due to hydrolysis becomes a concern. A resin composition is described that is optimized in the molecular structure design of the resin and in the catalyst in order to improve the hydrolysis resistance. Specifically, the resin composition contains (1) a copolymer of a vinyl compound having two or more epoxy groups, a carboxylic acid anhydride, and a transesterification reaction catalyst, or (2) a copolymer of a vinyl compound having two or more carboxylic acid anhydride groups, an epoxy, and a transesterification reaction catalyst.

An ink composition includes an acrylic resin including a polymerization product of a first monomer having a hydroxyl group, a second monomer having an epoxy group, a third monomer having an acrylate group, and a fourth monomer having a substituted or unsubstituted phenyl group, a first curing agent having an isocyanate group, and a second curing agent having an amine group. Durability and abrasion resistance of a window may be improved.

A window module including a window, a first print layer, an ink layer, and a protective layer covering the ink layer. The protective layer includes a polymer resin polymerized from monomers including a first monomer which is an acrylic monomer substituted with a hydroxy group, a second monomer having an epoxy group, and at least one of a third monomer having a substituted or unsubstituted phenyl group or a fourth monomer which is an acrylic monomer having a substituted or unsubstituted bicyclic alkyl group, and thus, has excellent durability, chemical resistance, and abrasion resistance.

A window module including a window, a first print layer, an ink layer, and a protective layer covering the ink layer. The protective layer includes a polymer resin polymerized from monomers including a first monomer which is an acrylic monomer substituted with a hydroxy group, a second monomer having an epoxy group, and at least one of a third monomer having a substituted or unsubstituted phenyl group or a fourth monomer which is an acrylic monomer having a substituted or unsubstituted bicyclic alkyl group, and thus, has excellent durability, chemical resistance, and abrasion resistance.

A window module including a window, a first print layer, an ink layer, and a protective layer covering the ink layer. The protective layer includes a polymer resin polymerized from monomers including a first monomer which is an acrylic monomer substituted with a hydroxy group, a second monomer having an epoxy group, and at least one of a third monomer having a substituted or unsubstituted phenyl group or a fourth monomer which is an acrylic monomer having a substituted or unsubstituted bicyclic alkyl group, and thus, has excellent durability, chemical resistance, and abrasion resistance.

A resin composition for a solar cell encapsulant that is used for forming a solar cell encapsulant, the resin composition including at least one kind of ethylene-polar monomer copolymer (A1) selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer (A2) (excluding the ethylene-polar monomer copolymer (A1)), an ethylene-α-olefin copolymer (B), and a metal inactivating agent (C).

A polymer comprising a first repeating unit including an amino group protected by an alkoxycarbonyl group; a second repeating unit including a nucleophilic group; and a third repeating unit including a crosslinkable group, wherein the first repeating unit, the second repeating unit, and the third repeating unit are different from each other.

The present invention provides an alicyclic epoxy acrylate compound that can have high heat resistance in the form of a cured product when contained in a curable composition, a curable composition, and a cured product.

An alicyclic epoxy acrylate compound represented by the following Formula (1) where A denotes an oxygen atom and a curable composition comprising thereof are used:

##STR00001##

wherein one of R.sub.1 and R.sub.2 is a (meth)acryloyloxy group, the other of R.sub.1 and R.sub.2 is a hydrogen atom, R.sub.3 to R.sub.20 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group, and A is an oxygen atom or A is not present, and a carbon atom to which R.sub.8 binds and a carbon atom to which R.sub.9 binds together form a double bond.

The present invention provides an alicyclic epoxy acrylate compound that can have high heat resistance in the form of a cured product when contained in a curable composition, a curable composition, and a cured product.

An alicyclic epoxy acrylate compound represented by the following Formula (1) where A denotes an oxygen atom and a curable composition comprising thereof are used:

##STR00001##

wherein one of R.sub.1 and R.sub.2 is a (meth)acryloyloxy group, the other of R.sub.1 and R.sub.2 is a hydrogen atom, R.sub.3 to R.sub.20 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group, and A is an oxygen atom or A is not present, and a carbon atom to which R.sub.8 binds and a carbon atom to which R.sub.9 binds together form a double bond.

The present invention provides an alicyclic epoxy acrylate compound that can have high heat resistance in the form of a cured product when contained in a curable composition, a curable composition, and a cured product.

An alicyclic epoxy acrylate compound represented by the following Formula (1) where A denotes an oxygen atom and a curable composition comprising thereof are used:

##STR00001##

wherein one of R.sub.1 and R.sub.2 is a (meth)acryloyloxy group, the other of R.sub.1 and R.sub.2 is a hydrogen atom, R.sub.3 to R.sub.20 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group, and A is an oxygen atom or A is not present, and a carbon atom to which R.sub.8 binds and a carbon atom to which R.sub.9 binds together form a double bond.