Patent classifications
C08F222/1067
A DIRECT INK WRITING THREE-DIMENSIONAL PRINTING METHOD BASED ON NEAR-INFRARED PHOTOPOLYMERIZATION
The invention relates to an ink based on near-infrared light polymerization. The method and technology of direct writing three-dimensional printing belong to the field of material processing technology area. The method is: direct writing nozzles move in three-dimensional space or stationery, the ink is squeezed out of the direct writing nozzle, receiving the near-infrared light irradiation, after curing, complete the three-dimensional object forming and curing. The solidifying time t does not exceed the ratio of near-infrared light diameter d.sub.1 and the ink extrusion speed vi, that is, t≤d.sub.1/v.sub.i. Since near-infrared light has a better medium mass penetration, can penetrate the structure during molding to promote both internal and external to a higher degree of curing, so as to achieve cross-scale structure 3D printing, and the method provided by the present invention accurately controls solidifying process of the ink and therefore achieve the DIW array 3D structure real-time curing.
A DIRECT INK WRITING THREE-DIMENSIONAL PRINTING METHOD BASED ON NEAR-INFRARED PHOTOPOLYMERIZATION
The invention relates to an ink based on near-infrared light polymerization. The method and technology of direct writing three-dimensional printing belong to the field of material processing technology area. The method is: direct writing nozzles move in three-dimensional space or stationery, the ink is squeezed out of the direct writing nozzle, receiving the near-infrared light irradiation, after curing, complete the three-dimensional object forming and curing. The solidifying time t does not exceed the ratio of near-infrared light diameter d.sub.1 and the ink extrusion speed vi, that is, t≤d.sub.1/v.sub.i. Since near-infrared light has a better medium mass penetration, can penetrate the structure during molding to promote both internal and external to a higher degree of curing, so as to achieve cross-scale structure 3D printing, and the method provided by the present invention accurately controls solidifying process of the ink and therefore achieve the DIW array 3D structure real-time curing.
Optical adhesive
An optical adhesive including a viscoelastic or elastomeric adhesive layer and a cured polymer layer immediately adjacent the viscoelastic or elastomeric adhesive layer is described. The viscoelastic or elastomeric adhesive layer a refractive index less than 1.570 and the cured polymer layer has a refractive index of at least 1.570. An interface between the viscoelastic or elastomeric adhesive layer and the cured polymer layer is structured. The cured polymer layer has a storage modulus of at least 2000 MPa at 20° C. and a glass transition temperature of no more than 65° C.
Optical adhesive
An optical adhesive including a viscoelastic or elastomeric adhesive layer and a cured polymer layer immediately adjacent the viscoelastic or elastomeric adhesive layer is described. The viscoelastic or elastomeric adhesive layer a refractive index less than 1.570 and the cured polymer layer has a refractive index of at least 1.570. An interface between the viscoelastic or elastomeric adhesive layer and the cured polymer layer is structured. The cured polymer layer has a storage modulus of at least 2000 MPa at 20° C. and a glass transition temperature of no more than 65° C.
ALICYCLIC ACRYLATE COMPOUND, ALICYCLIC EPOXY ACRYLATE COMPOUND, CURABLE COMPOSITION, AND CURED PRODUCT
The present invention provides an alicyclic epoxy acrylate compound that can have high heat resistance in the form of a cured product when contained in a curable composition, a curable composition, and a cured product.
An alicyclic epoxy acrylate compound represented by the following Formula (1) where A denotes an oxygen atom and a curable composition comprising thereof are used:
##STR00001##
wherein one of R.sub.1 and R.sub.2 is a (meth)acryloyloxy group, the other of R.sub.1 and R.sub.2 is a hydrogen atom, R.sub.3 to R.sub.20 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group, and A is an oxygen atom or A is not present, and a carbon atom to which R.sub.8 binds and a carbon atom to which R.sub.9 binds together form a double bond.
Radiation curable compositions and composite articles made using an additive manufacturing process
A radiation curable composition including at least one radiation hardenable component, a photo-initiator, and a filler material having a population of particulates in an amount greater than or equal to 50% by weight of the printable composition. The population of particulates exhibits a median diameter (D50) of greater than or equal to 0.3 micrometer on a volume-average basis as determined using the Particle Size Test Method, and the radiation curable composition exhibits a viscosity of less than or equal to 150 Pa s when measured using the Viscosity Test Method. A method, apparatus, and systems for producing composite articles by selectively exposing a portion of the radiation curable composition to a source of actinic radiation to at least partially cure the exposed portion of the radiation curable composition, thereby forming a hardened layer, preferably by an additive manufacturing process such as stereophotolithography, are also described. The composite articles may include composite dental restorations.
Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding
Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.
Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding
Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.
SYNTHETIC BARRIER MATERIAL AND METHOD OF MANUFACTURE THEREOF
A synthetic barrier material includes a light-cured polymer and graphene nanoplatelets in parallel alignment in the polymer. Disclosed further is a method for manufacturing the synthetic barrier material. The graphene nanoplatelets are dispersed in a photocurable resin and polarically aligned by an electric field. Furthermore, disclosed is a synthetic barrier film manufactured from the aforementioned synthetic barrier material or the aforementioned method.
SYNTHETIC BARRIER MATERIAL AND METHOD OF MANUFACTURE THEREOF
A synthetic barrier material includes a light-cured polymer and graphene nanoplatelets in parallel alignment in the polymer. Disclosed further is a method for manufacturing the synthetic barrier material. The graphene nanoplatelets are dispersed in a photocurable resin and polarically aligned by an electric field. Furthermore, disclosed is a synthetic barrier film manufactured from the aforementioned synthetic barrier material or the aforementioned method.