Provided is a polymer production method including: batch-adding a reaction solution including a monomer mixture including a maleimide-based monomer, a vinyl aromatic monomer, and a vinyl cyanide-based monomer and an aqueous solvent to a reactor and initiating polymerization; and carrying out the polymerization while continuously adding the maleimide-based monomer and the aqueous solvent to the reactor, wherein the reaction solution satisfies the above Formula 1.

The present invention provides a methacrylic resin composition comprising 100 parts by mass of a methacrylic resin comprising 50 to 97% by mass of a methacrylic acid ester monomer unit (A), 3 to 30% by mass of a structural unit (B) having a ring structure in the backbone, and 0 to 20% by mass of an additional vinyl monomer unit (C) copolymerizable with a methacrylic acid ester monomer, and 0.001 to 0.2 parts by mass of a compound (D) having a predetermined structure, the methacrylic resin composition satisfying the following conditions (I) and (II):
(I): a weight-average molecular weight of the methacrylic resin composition as measured by gel permeation chromatography (GPC) is 65,000 to 300,000, and
(II): a mass ratio between the component (D) and the structural unit (B) having a ring structure in the backbone is 25≤(B)/(D)≤1000.

The present invention provides a methacrylic resin composition comprising 100 parts by mass of a methacrylic resin comprising 50 to 97% by mass of a methacrylic acid ester monomer unit (A), 3 to 30% by mass of a structural unit (B) having a ring structure in the backbone, and 0 to 20% by mass of an additional vinyl monomer unit (C) copolymerizable with a methacrylic acid ester monomer, and 0.001 to 0.2 parts by mass of a compound (D) having a predetermined structure, the methacrylic resin composition satisfying the following conditions (I) and (II):
(I): a weight-average molecular weight of the methacrylic resin composition as measured by gel permeation chromatography (GPC) is 65,000 to 300,000, and
(II): a mass ratio between the component (D) and the structural unit (B) having a ring structure in the backbone is 25≤(B)/(D)≤1000.

Provided are a resist compound, a method of forming a pattern by using the same, and a method of manufacturing a semiconductor device using the same. According to the present disclosure, the compound may be represented by Formula 1:

##STR00001##

A propylene copolymer, a preparation method therefor, and an application thereof are provided. The copolymer forms a cross-linked network by means of a reaction between a furan-containing propylene copolymer and a small molecule of a coupling agent, thereby achieving a chemical bond connection between a polypropylene resin phase and an ethylene-propylene copolymer elastomer phase, fundamentally strengthening the force between the two phases, and improving the mechanical properties of a material. Meanwhile, the copolymer can achieve the decrosslinking of a material during melt processing such that the material has thermoplasticity, and after cooling, it can be crosslinked again to produce network structure.

A release coating composition comprises (A) an organopolysiloxane containing at least two (2) ethylenically unsaturated groups, (B) an organopolysiloxane containing at least 2 Si—H groups per molecule, and (C) a hydrosilylation catalyst. If the organopolysiloxane (A) contains only 2 ethylenically unsaturated groups, the organopolysiloxane (B) contains on average more than 2 Si—H groups per molecule. The composition further comprises (D1) a hydrosilylation inhibitor comprising a maleimide of the general formula (I):

##STR00001##

In formula (I), A.sup.3 represents a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms, and A.sup.1 and A.sup.2 each represent a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms. The composition yet further comprises (D2) a second hydrosilylation inhibitor selected from acetylenic compounds, ethylenically unsaturated isocyanates, acetylenically unsaturated silanes and unsaturated dicarboxylic acid diesters or a maleate compound or a mixture thereof.

A release coating composition comprises (A) an organopolysiloxane containing at least two (2) ethylenically unsaturated groups, (B) an organopolysiloxane containing at least 2 Si—H groups per molecule, and (C) a hydrosilylation catalyst. If the organopolysiloxane (A) contains only 2 ethylenically unsaturated groups, the organopolysiloxane (B) contains on average more than 2 Si—H groups per molecule. The composition further comprises (D1) a hydrosilylation inhibitor comprising a maleimide of the general formula (I):

##STR00001##

In formula (I), A.sup.3 represents a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms, and A.sup.1 and A.sup.2 each represent a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms. The composition yet further comprises (D2) a second hydrosilylation inhibitor selected from acetylenic compounds, ethylenically unsaturated isocyanates, acetylenically unsaturated silanes and unsaturated dicarboxylic acid diesters or a maleate compound or a mixture thereof.

A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of

##STR00001##

in which each of R.sup.1 is independently H or CH.sub.3, and n=1-4. R.sup.2 is a single bond, —O—,

##STR00002##

Each of R.sup.3 is independently

##STR00003##

A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of

##STR00001##

in which each of R.sup.1 is independently H or CH.sub.3, and n=1-4. R.sup.2 is a single bond, —O—,

##STR00002##

Each of R.sup.3 is independently

##STR00003##

The present invention is a resin composition, including: an addition polymerization resin α having a glass transition temperature of 150° C. or more; and a resin β having an aromatic dicarboxylic acid monomer unit A having a hydrophilic group and a dicarboxylic acid monomer unit B having no hydrophilic group. According to the present invention, a resin composition that can be easily removed with water while maintaining the heat resistance can be provided.