An infrared cut-off filter, including a cyanine dye and a copolymer. The cyanine dye includes tris(pentafluoroethyl) trifluorophosphate and a cation having a polymethine and a nitrogen-containing heterocycle at each end of the polymethine. The copolymer includes a first repeating unit from a first monomer and a second repeating unit from a second monomer different from the first monomer. The first monomer includes a phenolic hydroxyl group.

An infrared cut-off filter, including a cyanine dye and a copolymer. The cyanine dye includes tris(pentafluoroethyl) trifluorophosphate and a cation having a polymethine and a nitrogen-containing heterocycle at each end of the polymethine. The copolymer includes a first repeating unit from a first monomer and a second repeating unit from a second monomer different from the first monomer. The first monomer includes a phenolic hydroxyl group.

Amphiphilic copolymers and compositions including amphiphilic copolymers. The amphiphilic copolymers include modified maleimide subunits, for example, as illustrated by the structures of Formula I.sup.A and Formula I.sup.B. The compositions form water-soluble complexes upon association with biological material wherein such biological material can include lipids or membrane proteins. Methods for producing, purifying, analyzing, and using the compositions and complexes are provided.

Amphiphilic copolymers and compositions including amphiphilic copolymers. The amphiphilic copolymers include modified maleimide subunits, for example, as illustrated by the structures of Formula I.sup.A and Formula I.sup.B. The compositions form water-soluble complexes upon association with biological material wherein such biological material can include lipids or membrane proteins. Methods for producing, purifying, analyzing, and using the compositions and complexes are provided.

Provided herein according to some embodiments is a dual cure stereolithography resin that includes thermoplastic particles, which thermoplastic particles are insoluble in the resin and insoluble during a first, light, cure in which an intermediate object is produced, but then dissolve or swell in the intermediate object during the second, heat, cure.

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25° C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25° C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.

The inventionrelates to a curable mixture comprising: RM % of m-xylylene bismaleimide of formula (I) ##STR00001##
RP % of a polyimide component, and RC % of a comonomer component. Further, the invention relates to methods for the preparation of the curable mixture, methods for the preparation of a prepolymer, of a crosslinked polymer, and composite materials, in particular of fiber-reinforced composites. In addition, the present invention relates to a prepolymer, a crosslinked polymer and composite materials, in particular fiber-reinforced composites, obtainable by said methods.

A thiosulfate polymer composition includes an electron-accepting photosensitizer component, either as a separate compound or as an attachment to the thiosulfate polymer. The thiosulfate polymer composition can be applied to various articles, or used to form a predetermined polymeric pattern after photothermal reaction to form crosslinked disulfide bonds, removing non-crosslinked polymer, and reaction with a disulfide-reactive material. Such thiosulfate polymer compositions can also be used to sequester metals in nanoparticulate form, and as a way for shaping human hair in hairdressing operations.

Provided herein according to some embodiments is a dual cure stereolithography resin that includes a Diels-Alder adduct, which adduct is light polymerizable in the first, light, cure to produce an intermediate object, and on heating the intermediate object yields a bis-maleimide that can further react and/or polymerize during the second, heat, cure.