Provided are a resist compound, a method of forming a pattern by using the same, and a method of manufacturing a semiconductor device using the same. According to the present disclosure, the compound may be represented by Formula 1:

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Provided are a resist compound, a method of forming a pattern by using the same, and a method of manufacturing a semiconductor device using the same. According to the present disclosure, the compound may be represented by Formula 1:

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A resin composition includes the following components or a prepolymerized product thereof. (A) 100 parts by weight of a prepolymer and (B) 5 parts by weight to 30 parts by weight of a diallyl bisphenol resin, wherein the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. Moreover, the resin composition described above may also be made into articles such as a prepreg, a resin film, a laminate or a printed circuit board.

A thiosulfate polymer composition includes an electron-accepting photosensitizer component, either as a separate compound or as an attachment to the thiosulfate polymer. The thiosulfate polymer composition can be applied to various articles, or used to form a predetermined polymeric pattern after photothermal reaction to form crosslinked disulfide bonds, removing non-crosslinked polymer, and reaction with a disulfide-reactive material. Such thiosulfate polymer compositions can also be used to sequester metals in nanoparticulate form, and as a way for shaping human hair in hairdressing operations.

The present invention relates to a pressure-sensitive adhesive composition, a protective film, an optical element, and a display device. A pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to the present invention can have proper high-speed and low-speed peel strengths and simultaneously can exhibit an excellent balance between the high-speed and low-speed peel strengths. The pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to one exemplary embodiment of the present invention exhibits a proper level of surface resistance and excellent electrostatic discharge characteristics, and has no contaminants with respect to an adherend even when the pressure-sensitive adhesive sheet is peeled from the adherend after the pressure-sensitive adhesive sheet is attached to the adherend for a long period of time. Such a pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to one exemplary embodiment of the present invention can be applied to various fields of applications. For example, the pressure-sensitive adhesive sheet can be used as a protective film for optical members such as polarizing plates.

The present invention relates to a pressure-sensitive adhesive composition, a protective film, an optical element, and a display device. A pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to the present invention can have proper high-speed and low-speed peel strengths and simultaneously can exhibit an excellent balance between the high-speed and low-speed peel strengths. The pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to one exemplary embodiment of the present invention exhibits a proper level of surface resistance and excellent electrostatic discharge characteristics, and has no contaminants with respect to an adherend even when the pressure-sensitive adhesive sheet is peeled from the adherend after the pressure-sensitive adhesive sheet is attached to the adherend for a long period of time. Such a pressure-sensitive adhesive sheet formed using the pressure-sensitive adhesive composition according to one exemplary embodiment of the present invention can be applied to various fields of applications. For example, the pressure-sensitive adhesive sheet can be used as a protective film for optical members such as polarizing plates.

Biodegradable, cross-linked polymer particle embolics and methods of making the same are described. The particle embolics can be used as embolization agents.

Biodegradable, cross-linked polymer particle embolics and methods of making the same are described. The particle embolics can be used as embolization agents.

An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer.

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Biodegradable, cross-linked polymer particle embolics and methods of making the same are described. The particle embolics can be used as embolization agents.