An object of the present invention is to provide a pressure-sensitive adhesive sheet enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer containing an acrylic polymer (A) and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive layer has a dielectric constant at a frequency of 1 MHz of from 2.3 to 3.5. The pressure-sensitive adhesive sheet has a 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C. of 6 N/20 mm or more. In the pressure-sensitive adhesive sheet, the proportion of the 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C. to the 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 25° C. (180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C./180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 25° C.×100) is 30 or more.

An object of the present invention is to provide a pressure-sensitive adhesive sheet enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer containing an acrylic polymer (A) and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive layer has a dielectric constant at a frequency of 1 MHz of from 2.3 to 3.5. The pressure-sensitive adhesive sheet has a 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C. of 6 N/20 mm or more. In the pressure-sensitive adhesive sheet, the proportion of the 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C. to the 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 25° C. (180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C./180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 25° C.×100) is 30 or more.

An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability and transparency while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A), a mixture of monomer components constituting the acrylic polymer (A) or a partially polymerized product of a mixture of monomer components constituting the acrylic polymer (A), and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive composition comprises a branched-chain alkyl group having 10 to 24 carbon atoms as a monomer component. The hydrogenated polyolefinic resin (B) has a number average molecular weight (Mn) of 1000 to 5000 and a polydispersity (Mw/Mn) of 2.0 or less. The hydrogenated polyolefinic resin (B) contains at least one selected from the group consisting of a hydrogenated polyolefin and a hydrogenated polyolefin polyol. The pressure-sensitive adhesive composition comprises 3 to 35 parts by weight of the hydrogenated polyolefinic resin (B) based on 100 parts by weight of the acrylic polymer (A).

An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability and transparency while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A), a mixture of monomer components constituting the acrylic polymer (A) or a partially polymerized product of a mixture of monomer components constituting the acrylic polymer (A), and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive composition comprises a branched-chain alkyl group having 10 to 24 carbon atoms as a monomer component. The hydrogenated polyolefinic resin (B) has a number average molecular weight (Mn) of 1000 to 5000 and a polydispersity (Mw/Mn) of 2.0 or less. The hydrogenated polyolefinic resin (B) contains at least one selected from the group consisting of a hydrogenated polyolefin and a hydrogenated polyolefin polyol. The pressure-sensitive adhesive composition comprises 3 to 35 parts by weight of the hydrogenated polyolefinic resin (B) based on 100 parts by weight of the acrylic polymer (A).

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

A thermoplastic resin composition having good formability and low dielectric characteristics that have not been achieved by conventional liquid crystal polymer resin compositions, while maintaining excellent heat resistance and flame retardancy of liquid crystal polymers, and usable for information and communication devices used in a high frequency range is provided. A thermoplastic resin composition contains liquid crystal polymers (A) and a modified polyolefin (B) having a polar group. The liquid crystal polymer (A) contains a first liquid crystal polymer (a-1) that has a melting point of less than 300° C. and a second liquid crystal polymer (a-2) that has a melting point of 300° C. or more. It is preferable for the thermoplastic resin composition that the phase structure is a sea-island structure or a bicontinuous structure, and the second liquid crystal polymer (a-2) is contained at least in a sea phase or a continuous phase.

A thermoplastic resin composition having good formability and low dielectric characteristics that have not been achieved by conventional liquid crystal polymer resin compositions, while maintaining excellent heat resistance and flame retardancy of liquid crystal polymers, and usable for information and communication devices used in a high frequency range is provided. A thermoplastic resin composition contains liquid crystal polymers (A) and a modified polyolefin (B) having a polar group. The liquid crystal polymer (A) contains a first liquid crystal polymer (a-1) that has a melting point of less than 300° C. and a second liquid crystal polymer (a-2) that has a melting point of 300° C. or more. It is preferable for the thermoplastic resin composition that the phase structure is a sea-island structure or a bicontinuous structure, and the second liquid crystal polymer (a-2) is contained at least in a sea phase or a continuous phase.

A thermoplastic resin composition having good formability and low dielectric characteristics that have not been achieved by conventional liquid crystal polymer resin compositions, while maintaining excellent heat resistance and flame retardancy of liquid crystal polymers, and usable for information and communication devices used in a high frequency range is provided. A thermoplastic resin composition contains liquid crystal polymers (A) and a modified polyolefin (B) having a polar group. The liquid crystal polymer (A) contains a first liquid crystal polymer (a-1) that has a melting point of less than 300° C. and a second liquid crystal polymer (a-2) that has a melting point of 300° C. or more. It is preferable for the thermoplastic resin composition that the phase structure is a sea-island structure or a bicontinuous structure, and the second liquid crystal polymer (a-2) is contained at least in a sea phase or a continuous phase.

Provided is a method of making a polymeric composition comprising (a) providing a dispersion of initial polyolefin particles in an aqueous medium, wherein the initial polyolefin particles comprise (i) one or more hydrocarbon polyolefin, (ii) one or more non-hydrocarbon polyolefin, and (iii) one or more crosslinking agent; (b) contacting the initial polyolefin particles with a peroxide initiator to form crosslinked polyolefin particles.