Polymerizable compositions comprising a radically polymerizable resin can be polymerized in the absence of a peroxide initiator and other undesirable components. The polymerizable compositions and methods employ a manganese- or iron-containing salt or organic complex and a 1,3-dioxo compound with one or more other components. The polymerizable compositions have better storage stability and reduced gel time-drift.

Polymerizable compositions comprising a radically polymerizable resin can be polymerized in the absence of a peroxide initiator and other undesirable components. The polymerizable compositions and methods employ a manganese- or iron-containing salt or organic complex and a 1,3-dioxo compound with one or more other components. The polymerizable compositions have better storage stability and reduced gel time-drift.

Polymerizable compositions comprising a radically polymerizable resin can be polymerized in the absence of a peroxide initiator and other undesirable components. The polymerizable compositions and methods employ a manganese- or iron-containing salt or organic complex and a 1,3-dioxo compound with one or more other components. The polymerizable compositions have better storage stability and reduced gel time-drift.

Polymerizable compositions comprising a radically polymerizable resin can be polymerized in the absence of a peroxide initiator and other undesirable components. The polymerizable compositions and methods employ a manganese- or iron-containing salt or organic complex and a 1,3-dioxo compound with one or more other components. The polymerizable compositions have better storage stability and reduced gel time-drift.

Polymerizable compositions comprising a radically polymerizable resin can be polymerized in the absence of a peroxide initiator and other undesirable components. The polymerizable compositions and methods employ a manganese- or iron-containing salt or organic complex and a 1,3-dioxo compound with one or more other components. The polymerizable compositions have better storage stability and reduced gel time-drift.

Polymerizable compositions comprising a radically polymerizable resin can be polymerized in the absence of a peroxide initiator and other undesirable components. The polymerizable compositions and methods employ a manganese- or iron-containing salt or organic complex and a 1,3-dioxo compound with one or more other components. The polymerizable compositions have better storage stability and reduced gel time-drift.

Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.