A novolak resin including a partial structure represented by —C(CF.sub.3)H—. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by —C(CF.sub.3)H—. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by —C(CF.sub.3)H—. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by —C(CF.sub.3)H— with epihalohydrin in a presence of a base.

A photopolymerizable composition comprises at least a polymerizable resin, a photosensitizer, an annihilator, and a photoinitiator. The photosensitizer is formulated to absorb an excitation light signal received in a first range of wavelengths. The annihilator is formulated to emit a light signal in a second range of wavelengths different from the first. During the absorption of light by the photosensitizer in the first range of wavelengths, the annihilator emits a light signal in the second range, a photon energy of the emitted light signal being greater than a photon energy of the light signal received by the photosensitizer. The annihilator is also formulated to implement an energy transfer mechanism to excite the photoinitiator for polymerization of the resin. The excited photoinitiator is formulated to generate at least one polymerizable initiator to cause the polymerization reaction. Related methods, such as three-dimensional printing methods, and materials are also disclosed.

An adhesive composition which is excellent in adhesion to various hardly adhesive materials such as polyethylene terephthalate, polyethylene, polypropylene, modified polyphenylene ether, polyphenylene sulfide, and a cycloolefin polymer. Further, an adhesive composition containing the following components (A) to (C) may be described Component (A): (Meth) acrylic triblock elastomer having a weight average molecular weight of 80,000 or more, Component (B): (Meth) acrylate monomer having no hydroxyl group and having a phenoxy group, and Component (C): Radical initiator.

A light-shielding composition includes a light-shielding pigment, a resin, a polymerizable compound, which is a low-molecular-weight compound containing an ethylenically unsaturated group, and a polymerization initiator, in which the light-shielding pigment contains an inorganic particle, and an inorganic compound coating the inorganic particle, the inorganic particle contains one or more nitrogen-containing metal compounds selected from the group consisting of zirconium nitride, zirconium oxynitride, vanadium nitride, vanadium oxynitride, niobium nitride, and niobium oxynitride, the inorganic compound contains a silicon atom, and a contained atom number ratio of a total content of metallic atoms, which are selected from the group consisting of a zirconium atom, a vanadium atom, and a niobium atom, to a content of the silicon atom in a surface of the light-shielding pigment, as determined by X-ray photoelectron spectroscopy, is greater than 1.0.

Here are described polymers comprising monomeric units from vinylimidazole derivatives and their use in electrode materials and/or electrolyte compositions, as well as their methods of preparation. Also described are electrode materials, electrodes, and electrochemical cells comprising the polymers and their use.

Described herein are compositions comprising an actinically-crosslinkable polysiloxane-polyglycerol block copolymers, methods of making and use thereof, and devices comprising the compositions described herein. Disclosed herein are compositions comprising an actinically-crosslinkable polysiloxane-polyglycerol block copolymer derived from: a polysiloxane prepolymer comprising a polyglycerol side chain, the polyglycerol side chain comprising an ethylenically unsaturated group covalently linked thereto, wherein the ethylenically unsaturated group is actinically curable.

A layer including a block copolymer in which a microphase-separated structure of the block copolymer has been induced perpendicular to a substrate, this process being difficult in heating under atmospheric pressure; a method for producing the layer; and a method for producing a semiconductor device in which is used a vertically phase-separated layer of a block copolymer. A vertically phase-separated layer of a block copolymer formed by heating at a pressure below atmospheric pressure and a temperature at which induced self-assembly can occur.

The present application relates to a block copolymer and its use. The present application can provides a block copolymer that has an excellent self assembling property or phase separation property and therefore can be used in various applications and its use.

The present application relates to a block copolymer and its use. The present application can provides a block copolymer that has an excellent self assembling property or phase separation property and therefore can be used in various applications and its use.

The present application relates to a block copolymer and uses thereof. The present application can provide a block copolymer—which exhibits an excellent self-assembling property and thus can be used effectively in a variety of applications—and uses thereof.