Aspects of the present disclosure provide fluoropolymers and methods for forming and using such fluoropolymers. Fluoropolymers include polyfluorobenzoxazines and polyfluoroimides. Methods for forming polyphthalonitriles are also provided. The present disclosure is further directed to compositions containing one or more fluoropolymers and one or more metal oxides.

Aspects of the present disclosure provide fluoropolymers and methods for forming and using such fluoropolymers. Fluoropolymers include polyfluorobenzoxazines and polyfluoroimides. Methods for forming polyphthalonitriles are also provided. The present disclosure is further directed to compositions containing one or more fluoropolymers and one or more metal oxides.

A resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain, a radical polymerizable resin or compound (B) other than the bismaleimide compound (A), and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) contains at least one selected from the group consisting of a citraconimide group, a vinyl group, a maleimide group, a (meth)acryloyl group and an allyl group.

##STR00001##

Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1):

##STR00001##

wherein n represents an integer of 1 or larger.

The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1):

##STR00001##

wherein n represents an integer of 1 or larger.

There is provided an aromatic hydrocarbon formaldehyde resin obtained by reacting an aromatic hydrocarbon compound (A) represented by the following formula (1) with formaldehyde (B) in the presence of an acidic catalyst. ##STR00001##
wherein R represents an organic group having 1 to 10 carbon atoms; l represents an integer of 0 to 2, and m and n represent integers satisfying 1≦m+n≦10, m≧0 and n≧1.

There is provided an aromatic hydrocarbon formaldehyde resin obtained by reacting an aromatic hydrocarbon compound (A) represented by the following formula (1) with formaldehyde (B) in the presence of an acidic catalyst. ##STR00001##
wherein R represents an organic group having 1 to 10 carbon atoms; l represents an integer of 0 to 2, and m and n represent integers satisfying 1≦m+n≦10, m≧0 and n≧1.