A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

The present disclosure provides diglycidyl ethers and esters of 2,4-furandimethanol (2,4-FDME) and of 2,4-furandicarboxylic acid (2,4-FDCA), methods of making diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA, epoxy resins derived from diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA, and methods of making epoxy resins derived from diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA.

Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R.sup.5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3. ##STR00001##

Disclosed herein are emulsifiers for epoxy resins obtained by reacting an epoxy resin with a mixture of a polyethylene glycol having an average molecular weight of greater than 4000 g/mol and less than 10,000 g/mol and a block copolymer of polyethylene glycol and polypropylene glycol, aqueous epoxy resin dispersions including the same, and methods for preparation thereof.

Provided is an amorphous epoxy fiber excellent in dimensional stability, a fiber structure comprising at least in part amorphous epoxy fibers, and a molded body formed by melting said fibers. The amorphous epoxy fiber has a birefringence value of 0.005 or lower. For example, the amorphous epoxy fiber may include an amorphous epoxy resin represented by the following general formula:

##STR00001## in which, X is a residue of a bivalent phenol and n is 20 or greater (preferably 20 to 300, more preferably 40 to 280, still more preferably 50 to 250). The amorphous epoxy fiber may have an average fiber diameter of single fibers of 40 μm or smaller.

A bio-based resin obtained from a reaction mixture comprising a glycidyl ether component and a bio-based component comprising a fatty acid and a rosin acid, wherein the glycidyl ether component comprises at least two epoxide groups.

One-component electromagnetic curable novel toughened epoxy-hybrid structural adhesives, generally including: (a) a bisphenol A liquid epoxy resin, (b) a bisphenol F liquid epoxy resin, (c) a bisphenol A solid epoxy resin, (d) a novel toughening agent, (e) one or more mineral fillers, and (f) a curing agent. The structural adhesives of the present invention can be cured within seconds and are useful for a plurality of applications, including bonding OEM closure panel components, such as doors, hoods, fenders, etcetera.

An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of

##STR00001##

wherein X is —O—,

##STR00002##

and each R.sup.1 is independently CH.sub.3, CH.sub.2F, CHF.sub.2, or CF.sub.3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.