Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.

Grafted triglycerides comprising a triglyceride grafted with a fatty acid residue containing 4 to 30 carbon atoms are reacted with an epoxide resin and an amine curing agent to yield an epoxy thermoset. The grafted triglyceride is prepared by reaction of an epoxidized triglyceride with a fatty acid. By varying the length of the fatty residue, the number of fatty residues per triglyceride, the identity of the epoxy resin and the amine curing agent, it is possible to prepare epoxy thermosets that exhibit superior physical properties compared to the properties of epoxy thermosets prepared without the grafted triglyceride, or as compared to epoxy thermosets wherein the epoxidized triglyceride is used in place of the grafted triglyceride.

A coating composition includes a (A) binder component and a (B) pigment component. The (A) binder component includes (A1) polyvinyl butyrate, (A2) a particular film forming resin, (A3) an acid, (A4) an optional functionalized tri-alkoxy silane, and (A5) an optional polymeric phosphate ester. The (B) pigment component includes (B1) a calcium ion-exchanged silica, (B2) a corrosion inhibiting pigment, and (B3), a polyalkylene oxide phosphate. The coating composition is formed by combining the aforementioned components. In a method, the coating composition is applied to a substrate.

Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.

A coating composition includes a (A) binder component and a (B) pigment component. The (A) binder component includes (A1) polyvinyl butyrate, (A2) a particular film forming resin, (A3) an acid, (A4) an optional functionalized tri-alkoxy silane, and (A5) an optional polymeric phosphate ester. The (B) pigment component includes (B1) a calcium ion-exchanged silica, (B2) a corrosion inhibiting pigment, and (B3), a polyalkylene oxide phosphate. The coating composition is formed by combining the aforementioned components. In a method, the coating composition is applied to a substrate.

The present invention relates to the use of bis-anhydrohexitol ethers as reactive diluents in a crosslinkable resin, adhesive, coating or composite matrix composition. Not only do these products make it possible to advantageously reduce the viscosity of the mixtures obtained, but they also lead to a very small reduction in the glass transition temperature of the crosslinked mixtures, compared to other reactive diluents, while spectacularly improving the mechanical properties of the latter such as the Young's modulus, the tensile strength, the elongation at break and the toughness.

A curing agent or a curing accelerator which is easy to synthesize and may cure an epoxy resin and the like, or may accelerate the curing is provided. A curing agent or a curing accelerator according to some embodiments of the present invention has a highly-coordinated silicon structure.

The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.

The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.

An anion exchange stationary phase includes a negatively charged substrate particle, a base condensation polymer layer, a crosslinked ethanolamine condensation polymer, and a glycidol condensation layer. The crosslinked ethanolamine condensation polymer layer can be covalently attached to the base condensation polymer layer. The crosslinked ethanolamine condensation polymer layer can be formed by a condensation reaction product of a polyepoxide compound and ethanolamine. The glycidol condensation layer can be formed by the treatment of glycidol. The anion exchange stationary phase are suitable for separating a variety of haloacetic acids and common inorganic anions in a single chromatographic run in less than 20 to 35 minutes.