Disclosed herein are methods of preparing an aminimide. An epoxy compound is reacted with a hydrazine compound comprising a trivalent nitrogen, and an anhydride functional material or a cyclic compound containing a carbonyl group and at least one heteroatom alpha to the carbonyl group at a temperature greater than 20° C. to form the aminimide. At least one of the epoxy compound and the anhydride functional material or the cyclic compound is polymeric.

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

Presently described are curable compounds and curable compositions. Thermosets including the curable compounds and curable compositions described herein are derived from bio-based components and have improved mechanical properties. The described compositions can also be applicable to rosin derivatives and fatty acid derivatives.

The present invention relates to novolac vinyl esters useful as thermal resistance conferring components for anaerobic curable compositions, and anaerobic curable compositions having such novolac vinyl esters. The compositions are particularly useful as adhesives and sealants.

The present invention discloses a fluorine-modified epoxy acrylic resin, an UV-curable varnish and a method for preparing the same, and a method for coating the varnish on a substrate. The fluorine-modified epoxy acrylic resin is prepared by a process including the following steps: generating an epoxy acrylic resin via a ring-opening esterification reaction between an unsaturated mono-carboxylic acid and at least one epoxy group in an epoxy resin; and generating an epoxy acrylic resin containing fluorinated side groups via an esterification reaction between a fluorocarboxylic acid or a fluorocarboxylic acid anhydride and at least one hydroxy group in the epoxy acrylic resin. The UV-curable varnish according to the invention is prepared based on the fluorine-modified epoxy acrylic resin. When the varnish is applied to the surface of a substrate, at least one performance of the material, thereby the service life of the material itself may be improved.

The present application relates to a coating composition and wood article manufactured therefrom, the coating composition comprising: (A) a film-forming resin composition comprising a reactive donor capable of providing two or more nucleophilic carbanions, and a reactive acceptor comprising two or more carbon-carbon double bonds; (B) a catalyst for catalyzing the Michael addition crosslinking reaction between the reactive donor and the reactive acceptor, wherein the reactive donor has an aromatic epoxy backbone, and wherein the reactive donor has an epoxy equivalent weight in the range of from 400 to 1100 g/mol, preferably in the range of from 470 to 1000 g/mol, more preferably in the range of from 470 to 900 g/mol.

This invention outlines a method for synthesizing a blended resin system in a one pot reaction that may utilize, for example, bio-based anhydrosugars such as isosorbide as a principle component to produce isosorbide dimethacrylate and other monomeric materials for thermosetting applications. This invention establishes a one-pot procedure for reacting a hydroxy group containing compound with methacrylic anhydride in the first step and using the by-product methacrylic acid to react with glycidyl ethers to form additional methacrylate compounds in the second step. This methodology can be formulated to produce a wide array of resin systems that have controlled ratios of hydroxy group containing compound/crosslinker/reactive diluent. Additionally, the novel resin systems may be partially to fully biobased, promoting global sustainability and reducing costs, and when free radically polymerized have properties that meet or exceed their petroleum derived counterparts.

A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, —Y— represents —OCO—, —O— or —S—, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).

An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.

A pressure sensitive adhesive construct comprising: (A) a backing substrate; and (B) a pressure sensitive adhesive composition disposed on the backing substrate, wherein the pressure sensitive adhesive composition includes an ultraviolet radiation-cured polymer made from: (a) at least one epoxidized plant oil, at least one epoxidized animal fat, or a mixture thereof; (b) at least one dicarboxylic acid, at least one polycarboxylic acid, or a mixture thereof; and (c) at least one compound that contains both one carbon-carbon double bond (C═C) and at least one carboxylic acid group.