A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, $\frac{\sigma D\times \sigma H}{\sigma D+\sigma H}\le 1.0,$
where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of below 4 Pas at 150° C., d) at least one of a curing agent D capable of reacting with A, B and optionally C, e) and optionally additional compounds,
wherein the glass transition temperature of the uncured material is at least 30° C., preferably at least 40° C. as measured with DSC at a heating rate of 20° C./min.

The invention further relates to a method of producing a cured 3D thermoset object and the use of the above-mentioned thermosetting material in a 3D printing process.

The present invention relates to a thermosetting material for use in a 3D printing process comprising: a) at least one epoxy resin A, b) at least one elastomer-modified epoxy resin B, c) at least one resin C with a dynamic viscosity of below 4 Pas at 150° C., d) at least one of a curing agent D capable of reacting with A, B and optionally C, e) and optionally additional compounds,
wherein the glass transition temperature of the uncured material is at least 30° C., preferably at least 40° C. as measured with DSC at a heating rate of 20° C./min.

The invention further relates to a method of producing a cured 3D thermoset object and the use of the above-mentioned thermosetting material in a 3D printing process.

A method for recycling matrix residues includes steps of degrading a target epoxy to form matrix residues, collecting the matrix residues, and adding the matrix residues into a polymer-forming formulation. Characteristically, the polymer-forming formulation includes multifunctional anhydride monomers and polyfunctional co-reactant monomers.

A method for recycling matrix residues includes steps of degrading a target epoxy to form matrix residues, collecting the matrix residues, and adding the matrix residues into a polymer-forming formulation. Characteristically, the polymer-forming formulation includes multifunctional anhydride monomers and polyfunctional co-reactant monomers.

A winterized paraffin inhibitor, which is capable of being used for preventing the deposition of paraffins in hydrocarbon streams and capable of withstanding freezing or crystallization at freezing or sub-freezing temperatures, may be formed by adding an oxyalkylated branched aliphatic compound having 12 or more carbons to a high molecular weight aliphatic polymer paraffin inhibitor, the oxyalkylated branched aliphatic compound having 12 or more carbons being produced by the oxyalkylation of the branched aliphatic compound having 12 or more carbon atoms in which the branched aliphatic compound having 12 or more carbon atoms is grafted with a polyether via a ring-opening reaction, wherein the polyether is a polymer of ethylene oxide, propylene oxide, butylene oxide, and combinations thereof.

A winterized paraffin inhibitor, which is capable of being used for preventing the deposition of paraffins in hydrocarbon streams and capable of withstanding freezing or crystallization at freezing or sub-freezing temperatures, may be formed by adding an oxyalkylated branched aliphatic compound having 12 or more carbons to a high molecular weight aliphatic polymer paraffin inhibitor, the oxyalkylated branched aliphatic compound having 12 or more carbons being produced by the oxyalkylation of the branched aliphatic compound having 12 or more carbon atoms in which the branched aliphatic compound having 12 or more carbon atoms is grafted with a polyether via a ring-opening reaction, wherein the polyether is a polymer of ethylene oxide, propylene oxide, butylene oxide, and combinations thereof.

A resin composition for molding includes an epoxy resin, a curing agent, and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.

A resin composition for molding includes an epoxy resin, a curing agent, and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.

An ultraviolet (UV) curable organopolysiloxane composition with excellent workability when applied to a substrate is provided, in which a product obtained by curing the composition has a low dielectric constant. The UV curable organopolysiloxane composition comprises (A) one or more organosiloxane and/or organopolysiloxane having an average of two or more UV reactive functional groups in one molecule, and (B) one or more organosilane, organosiloxane, and/or organopolysiloxane having one UV reactive functional group in one molecule. An organic solvent is not included in the composition. In addition to components (A) and (B), the composition can comprise one or a plurality of additives selected from a group consisting of: (D1) nonionic surfactants not containing a silicon atom and are not acrylic; (D2) nonionic surfactants containing a silicon atom and having an HLB value of 4 or less; and (D3) silicone oils with a viscosity of 90 mPa-s or less at 25° C.