Multi-layer electrochromic structures, and processes for assembling such structures, incorporating a cross-linked ion conducting polymer layer that maintains high adhesive and cohesive strength in combination with high ionic conductivity for an extended period of time, the ion conducting polymer layer characterized by electrochemical stability at voltages between about 1.3 V and about 4.4 V relative to lithium, lithium ion conductivity of at least about 10.sup.−5 s/cm, and lap shear strength of at least 100 kPa, as measured at 1.27 mm/min in accordance with ASTM International standard D1002 or D3163.

An epoxy resin composition (A), having an epoxy resin represented by formula (1):

##STR00001##

and an epoxy resin represented by formula (2):

##STR00002##

where R.sup.1 is a linear aliphatic hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 0 or 1. An epoxy resin composition (B), having 100 parts by weight of the epoxy resin composition (A) and 0.01 to 1,000 parts by weight of a curing agent.

The present invention relates to an epoxy resin system having a phase separation structure, a preparation method therefor and an application thereof. After mixing an epoxy resin, an amine curing agent and an epoxy diluent, pre-polymerization is carried out to obtain a prepolymer 1; or, after mixing an epoxy resin and an amine curing agent, pre-polymerization is carried out to obtain a prepolymer 1; after mixing an epoxy resin, an anhydride curing agent and an accelerator, polymerization is carried out to obtain a prepolymer 2; and after the prepolymer 1 and the prepolymer 2 are mixed, curing is carried out to obtain an epoxy resin system having a phase separation structure. The present invention controls the formation of a thermosetting epoxy resin system having a phase separation structure by means of preparing different epoxy resin pre-polymerization systems and using an interface reaction between the different pre-polymerization systems.

The specific embodiment of the present disclosure provides a protective coating. An anticorrosive coating having a compact rigid molecular structure is formed by plasma polymerization coating of monomers including alicyclic epoxy structural units, and a hydrophobic coating is simultaneously formed by plasma polymerization coating on the anticorrosive coating, thus, coatings with excellent protective performance to the substrate are formed.

Described is a curable composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; a compatibilizer having at least one silane group and at least one epoxy terminal group or at least one nitrogen-containing groups; and optionally a hardening agent; wherein the composition further optionally comprises at least one of a nitrogen-containing unsaturated heterocyclic compound catalyst and a nitrogen-containing phenol catalyst. The curable composition exhibits high hermeticity, fast curing speed, quick adhesion build up, dry surface and strong adhesion strength. A method for applying the curable composition on the surface of a substrate is also provided.

The present invention provides a two-part thermal conductive epoxy adhesive composition with high bonding strength and low modulus. The present invention also provides a preparing method and use thereof.

An epoxy resin composition comprising the following components (A) to (E). Component (A) is a compound containing two or more epoxy groups. Component (B) is phenyl monoglycidyl ether having an alkyl group with 1 to 10 carbon atoms. Component (C) is an oxetane compound. Component (D) is a thiol curing agent. Component (E) is a curing accelerator.

Resins and formulations of individual monomers bearing both vinyl ester and epoxy functionality were either synthesized or formulated such that vinyl ester components capable of polymerizing by photo-induced, free radical polymerization were mixed with step-growth epoxy-amine systems, facilitating sequential cure. The vinyl ester component was photopolymerized using vat photopolymerization (VPP). Additionally, the preparation of bio-based photo curable thermosetting resins that have tailorable thermal and mechanical properties is provided. All monomers and polymers described herein are useful in a variety of applications, including additive manufacturing applications.

A two-component epoxy resin composition, made of: a resin component including: at least one epoxy resin that contains on average more than one epoxy group per molecule; up to 25 wt.-% of at least one epoxy-functional reactive diluent having one or two epoxy groups per molecule; and a hardener component including: between 40 and 80 wt.-% of at least one amino-functional hardener of formula (I),

##STR00001##

wherein n is an integer with a value of 2 or 3, R.sup.1 is a linear, cyclic or branched alkyl residue that optionally contains ether oxygen atoms and R.sup.2 is a methyl or ethyl group; between 10 and 30 wt.-% of at least one Lewis base having at least one tertiary amino group, amidine group, or guanidine group; and between 10 and 30 wt.-% of at least one carboxylic acid.

A photocurable liquid silicone composition, that has low viscosity that facilitates injection into a small gap, cures quickly by irradiating with a high energy beam such as ultraviolet light or the like, has a refractive index after curing that is high not only in a visible region but also in an infrared region, in which composition design is possible to provide an arbitrarily low dielectric constant, and is particularly useful as a material for a device using an infrared LED light source, is provided. The composition comprises: (A) one or more type of an organosilane or organopolysiloxane having on average one or more photoreactive functional groups and two or more monovalent functional groups selected from aromatic groups with 6 to 12 carbon atoms and aralkyl groups with 7 to 12 carbon atoms in a molecule and having 1 to 5 silicon atoms, and optionally further comprising (C) a curing catalyst.