The present invention addresses the problem of providing a prepreg that yields a carbon fiber composite material that has exceptional tensile strength, heat resistance, and impact resistance and is suitable as a structural material of an aircraft body, wherein the resin composition used in the prepreg furthermore has exceptional viscosity stability, the prepreg containing a resin composition that contains carbon fibers and at least the constituent elements [A]—[D] as defined.

The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

A negative-working photosensitive resin composition including an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator, in which a photosensitive resin film having a film thickness of 20 μm obtained by applying the negative-working photosensitive resin composition onto a silicon wafer and performing a bake treatment at 90° C. for 5 minutes has a Martens hardness of less than 235 [N/mm.sup.2], and when a viscoelasticity of a cured film, which is obtained by exposing the photosensitive resin film to i-rays at an irradiation amount of 200 mJ/cm.sup.2, performing a bake treatment after the exposure at 90° C. for 5 minutes, and then performing a bake treatment at 200° C. for 1 hour to cure the photosensitive resin film, is measured at a frequency of 1.0 Hz, a tensile elastic modulus (E*) of the cured film at a temperature of 175° C. is 2.1 [GPa] or more.

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4):

[A]: epoxy resin
[B]: aromatic diamine
[C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.60 or less in a ratio m/M of a molecular weight m thereof to a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition. (3): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (2) is 0.01 or more and 0.20 or less; and (4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

Provided herein is a dual cure resin useful for the production of objects by stereolithography, said resin comprising a mixture of: (a) a light-polymerizable component; and (b) a heat-polymerizable component, said heat-polymerizable component comprising: (i) a dicyclopentadiene-containing polyepoxide resin; (ii) a cyanate ester resin; (iii) an epoxy-reactive toughening agent; and (iv) a core shell rubber toughener.

Provided herein is a dual cure resin useful for the production of objects by stereolithography, said resin comprising a mixture of: (a) a light-polymerizable component; and (b) a heat-polymerizable component, said heat-polymerizable component comprising: (i) a dicyclopentadiene-containing polyepoxide resin; (ii) a cyanate ester resin; (iii) an epoxy-reactive toughening agent; and (iv) a core shell rubber toughener.

The invention relates to a composition containing at least one catalyst (C1) containing at least one atom of an element (M1) chosen from: Al, Sc, Ti, Mg, Mn, Fe, Co, Ni, Cu, Zn, Zr, Sn, Hf, Pb, Si, Sb and In; a catalyst (C2) comprising at least one atom of an element (M2) chosen from alkali metals and alkaline-earth metals; a thermosetting resin and/or a hardener for a thermosetting resin. The invention also relates to the use of this composition for rendering a resin which is in the thermoset state hot-deformable and nevertheless free of any residual stress after the deformation thereof; such a resin will advantageously retain its shape even if it is subsequently subjected to high temperatures. The invention relates, moreover, to kits for preparing the composition, to a thermoset-resin-based object obtained from a composition of the invention, to a process for manufacturing objects, to a process for hot-deformation of objects and to various possible uses of the compositions and objects of the invention.