The patent application discloses a degradable thermoset composite. The composite comprises a reaction product of an epoxy resin mixture, a cross-linker, a catalyst. The epoxy resin mixture may comprise at least one aromatic epoxy resins having a glass transition temperature greater than or equal to 150° C. The reaction product may have a glass transition temperature greater than or equal to 110° C. as measured by DSC or DMA.

This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.

A curable epoxy composition suitable for surface application, comprising one or more epoxy resin (s); 2, 4, 6-tribromophenyl end-capped tetrabromobisphenol A epoxy-based flame retardant; and phosphorus-containing compound selected from the group consisting of one or more of: ammonium polyphosphate; resorcinol bis (diphenyl phosphate); and liquid alkylated triphenyl phosphate ester. The composition is substantially Sb.sub.2O.sub.3-free.

An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.

The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

A thermosetting resin composition, which constitutes at least a part of a heat-dissipating insulating member interposed between a heat-generating body and a heat-dissipating body, includes (A) an epoxy resin, (B) a thermosetting resin (excluding epoxy resin (A)), (C) a phenoxy resin having a mesogenic structure in the molecule, (D) thermally conductive particles, and (E) an organosiloxane compound.

Disclosed is an environment-friendly vinyl ester resin, which is prepared by mixing following raw materials in percentage by weight: 20-65 weight percentage (wt %) of epoxy resin, 5-35 wt % of methyl monomer, 8-25 wt % of unsaturated acid, 0.01-0.3 wt % of a catalyst, 0.01-0.08 wt % of polymerization inhibitor and 10-40 wt % of a cross-linking agent.

The present disclosure relates to the field of epoxide synthesis, and particularly to a safe, environmentally friendly and controllable method for preparing cycloaliphatic diepoxides. The method comprises the steps of: mixing a diene compound, a carboxylic acid, an alkaline salt, and a solvent, and cooling; dropwise adding a hydrogen peroxide solution thereto over 1-12 h; standing for layering to obtain an underlayer of an organic phase 1, washing the organic phase 1 with a washing liquid, and standing for layering to obtain an underlayer of an organic phase 2; and purifying the organic phase 2. The reaction system of the present disclosure is simple, environmentally friendly, safe and controllable, and the production cost is low, which can meet the technical and economic requirements. The obtained cycloaliphatic diepoxides have high purity, high yield, low solvent content, low chroma and low halogen content, which are suitable for large-scale industrial production.