A curable epoxy composition suitable for surface application, comprising one or more epoxy resin(s); 2,4,6-tribromophenyl end-capped tetrabromobisphenol A epoxy-based flame retardant; and phosphorus-containing compound selected from the group consisting of one or more of: ammonium polyphosphate; resorcinol bis (diphenyl phosphate); and liquid alkylated triphenyl phosphate ester. The composition is substantially Sb.sub.2O.sub.3-free.

A novolak resin including a partial structure represented by —C(CF.sub.3)H—. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by —C(CF.sub.3)H—. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by —C(CF.sub.3)H—. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by —C(CF.sub.3)H— with epihalohydrin in a presence of a base.

A compound represented by the following formula (1): ##STR00001##
wherein R.sup.1 is a monovalent organic group containing a polyether chain; X.sup.1 and X.sup.2 are each individually a monovalent group; and the polyether chain is a chain represented by the following formula: —(OC.sub.6F.sub.12).sub.m11—(OC.sub.5F.sub.10).sub.m12—(OC.sub.4F.sub.8).sub.m13—(OC.sub.3X.sup.10.sub.6).sub.m14—(OC.sub.2F.sub.4).sub.m15—(OCF.sub.2).sub.m16—, wherein m11, m12, m13, m14, m15, and m16 are each individually an integer of 0 or 1 or greater; X.sup.10s are each individually H, F, or Cl; the repeating units are present in any order; and the sum of m11 to m16 is an integer of 10 or greater, R.sup.1 being other than those containing a urethane bond.

Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).

A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.

A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.

A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated on the pre-treated surface. A printed wiring board includes an insulating base layer, a conductive pattern laminated on at least one surface of the base layer, and the coverlay for a printed wiring board, the coverlay being laminated on the conductive pattern.

A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated on the pre-treated surface. A printed wiring board includes an insulating base layer, a conductive pattern laminated on at least one surface of the base layer, and the coverlay for a printed wiring board, the coverlay being laminated on the conductive pattern.

A polymer formed of at least one phenylphosphine oxide functional epoxide crosslinked with at least one phenylphosphine oxide amine such that the polymer has phosphorous concentrations of at least about 8 percent by weight, at least about 8.5 percent by weight, or any value or range of values therebetween.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.