The present invention provides an alicyclic epoxy acrylate compound that can have high heat resistance in the form of a cured product when contained in a curable composition, a curable composition, and a cured product.

An alicyclic epoxy acrylate compound represented by the following Formula (1) where A denotes an oxygen atom and a curable composition comprising thereof are used:

##STR00001##

wherein one of R.sub.1 and R.sub.2 is a (meth)acryloyloxy group, the other of R.sub.1 and R.sub.2 is a hydrogen atom, R.sub.3 to R.sub.20 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group, and A is an oxygen atom or A is not present, and a carbon atom to which R.sub.8 binds and a carbon atom to which R.sub.9 binds together form a double bond.

The disclosure generally relates to omniphobic compatibilizers, which include a polymerization reaction product between a first vinyl monomer, optionally a second vinyl crosslinking monomer, and a functionalized omniphobic polymer. The functionalized omniphobic polymer can include two or more vinyl functional groups or at least one free radical initiator functional group such that the reaction product forming the omniphobic compatibilizer can be a vinyl or free-radical polymerization product. The omniphobic compatibilizer can be incorporated into a UV-curable or a non-UV-curable thermoset omniphobic composition. The UV-curable composition can be a crosslinked polymerization reaction product between the omniphobic compatibilizer, a third vinyl monomer, and a fourth polyvinyl crosslinking monomer. The non-UV-curable composition can be a crosslinked polymerization reaction product between the omniphobic compatibilizer, a first thermosetting component, and a second thermosetting component. The thermoset omniphobic composition can be a coating on a substrate in a corresponding coated article.

The disclosure generally relates to omniphobic compatibilizers, which include a polymerization reaction product between a first vinyl monomer, optionally a second vinyl crosslinking monomer, and a functionalized omniphobic polymer. The functionalized omniphobic polymer can include two or more vinyl functional groups or at least one free radical initiator functional group such that the reaction product forming the omniphobic compatibilizer can be a vinyl or free-radical polymerization product. The omniphobic compatibilizer can be incorporated into a UV-curable or a non-UV-curable thermoset omniphobic composition. The UV-curable composition can be a crosslinked polymerization reaction product between the omniphobic compatibilizer, a third vinyl monomer, and a fourth polyvinyl crosslinking monomer. The non-UV-curable composition can be a crosslinked polymerization reaction product between the omniphobic compatibilizer, a first thermosetting component, and a second thermosetting component. The thermoset omniphobic composition can be a coating on a substrate in a corresponding coated article.

The present disclosure relates to encapsulant compositions for use with hard disk drive devices.

Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.

The present invention relates to a powder coating composition including: an addition polymer including epoxy functional groups: a carboxylic acid functional crosslinker: and a blocked isocyanate functional crosslinker. The addition polymer is obtained from components including at least one epoxy functional ethylenically unsaturated monomer. The components include an amount of the at least one epoxy functional ethylenically unsaturated monomer within a range of greater than 10 weight % and less than 22 weight %. based on the components that form the addition polymer.

The present invention provides a curable composition for a hard disk drive, the composition comprising: a compound (component A1) having an ethylenically unsaturated group and having no epoxy group and a compound (component A2) having an ethylenically unsaturated group and an epoxy group, or the component A2 and a compound (component A3) having an epoxy group and having no ethylenically unsaturated group, or the component A1 and the component A3, or the component A1, the component A2, and the component A3, or the component A2; a photo-radical polymerization initiator (component B); and a compound (component C) capable of causing the epoxy group to undergo polymerization, and a method for producing a hard disk drive, which comprises the step of bonding a part to a magnetic head portion using the composition.

This document relates to compositions including a crosslinkable polymer including a pendant epoxide repeat unit and an amine crosslinker, and methods of treating a subterranean formation by providing the composition to the formation. The pendant epoxide repeat unit has the structure ##STR00001##
Each R.sup.1 is independently a (C.sub.1-C.sub.10) alkylene or (C.sub.1-C.sub.10) alkylene ether, each alkylene ether independently having a ratio of carbon atoms to oxygen atoms of 1:1 to 4:1.

The present disclosure relates to encapsulant compositions for use with hard disk drive devices.

A method for a synthesis of a polymer containing multiple epoxy groups includes steps of: under protection of nitrogen or argon, with a photosensitive free radical initiator under an ultraviolet light irradiation, initiating a mixture of a dithiol compound and alkynyl glycidyl ether or other alkynyl-containing compounds to proceed a thiol-yne polymerization, so as to obtain the polymer. The number of the epoxy groups is able to be adjusted through changing a type of a dithiol monomer, a mixing ratio of the dithiol monomer, and a mixing ratio between the alkynyl glycidyl ether and other alkynyl compounds. The present invention has advantages of: fast reaction, convenient process, easy post-processing, a large number of the epoxy groups, and adjustable and controllable content. The obtained polymer has a wide potential application in fields of coating, adhesive, ink, encapsulating material, resin for composite material, additive, high performance material, function material, and so on.