Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

A negative-working photosensitive resin composition including an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator, in which a photosensitive resin film having a film thickness of 20 μm obtained by applying the negative-working photosensitive resin composition onto a silicon wafer and performing a bake treatment at 90° C. for 5 minutes has a Martens hardness of less than 235 [N/mm.sup.2], and when a viscoelasticity of a cured film, which is obtained by exposing the photosensitive resin film to i-rays at an irradiation amount of 200 mJ/cm.sup.2, performing a bake treatment after the exposure at 90° C. for 5 minutes, and then performing a bake treatment at 200° C. for 1 hour to cure the photosensitive resin film, is measured at a frequency of 1.0 Hz, a tensile elastic modulus (E*) of the cured film at a temperature of 175° C. is 2.1 [GPa] or more.

Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants.

This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the epoxy resin is partially or fully an epoxy resin represented by the following general formula (1). Each R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, each R.sup.2 represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; and m represents a number of 0 to 5.

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The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

A one-part primer composition is provided. The one-part primer composition includes a first epoxy resin that is a liquid under ambient conditions a particulate corrosion inhibitor present in an amount of from 5 wt % to 30 wt % relative to the overall weight of the composition excluding carrier solvents and water, a curative comprising a primary aromatic amine, a silane coupling agent, a carrier solvent; and water homogeneously mixed with the carrier solvent and present in an amount sufficient to hydrolyze the silane coupling agent while preserving solubility of the first epoxy resin and curative in the carrier solvent/water mixture. The corrosion inhibitor is pre-dispersed in a liquid epoxy to break the agglomeration of the inhibitors, mitigate settling of the pigment and improve primer performance.

Provided are a resin composition, which is used for transfer molding, including a resin (A), a magnetic powder (B) having a median diameter of 7.5 to 100 μm, and particles (C) having a median diameter of 0.2 to 5 μm, in which a saturation magnetic flux density of a molded article obtained by transfer molding the resin composition at 175° C. is equal to or more than 1.1 T; and a molded article formed of the resin composition. The particles (C) may include a magnetic powder or a non-magnetic powder.

Provided is a photosensitive resin composition which comprises (A) a polymer comprising repeating units represented by formula (A1) and at least one kind of repeating units selected from among repeating units represented by formula (A2) and repeating units represented by formula (A3), (B) an epoxy compound containing four or more epoxy groups on average in the molecule, (C) a photoacid generator, (D) a benzotriazole compound and/or an imidazole compound, and (E) an organic solvent.

##STR00001##

In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, in which (A) the polymer compound has a carboxylic acid residue at a molecular chain terminal.