An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4):

[A]: epoxy resin
[B]: aromatic diamine
[C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.60 or less in a ratio m/M of a molecular weight m thereof to a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition. (3): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (2) is 0.01 or more and 0.20 or less; and (4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

An epoxy compound, composition and cured product thereof are provided. The epoxy compound has a structure represented by Formula (I)

##STR00001##

wherein R.sup.1 and R.sup.2 are each independently cyano group, isocyanate group, oxiranyl, methyloxiranyl group, glycidyl group, methylglycidyl group, epoxypropyl group, oxetanyl group, oxetanemethyl group, or C.sub.1-C.sub.10 alkoxy group; Z is —O—,

##STR00002##

R.sup.3 and R.sup.4 are each independently hydrogen, fluorine, methyl, fluoromethyl, or ethyl; n and m are each independently 3, 4, 5, 6, 7, 8, 9, or 10; and i and j are each independently 1, 2, or 3.

An adhesion promoter comprises a reaction product of: a) a polyepoxide; b) an aminosilane represented by the formula HNR.sup.1R.sup.2. R.sup.1 and R.sup.2 independently represent —Z—SiL.sub.3. Each Z independently represents a divalent linking group having from 1 to 12 carbon atoms, and each L independently represents a hydrolyzable group; and c) an isocyanatosilane represented by the formula O═C═N—Z—SiL.sub.3, wherein Z and L are as previously defined. The adhesion promoter may be used to treat a surface of a substrate such as an abrasive particle, which may be included in a resin-bond abrasive article.

A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life.

The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

An epoxy resin composition including components (A), (B), (C) and (D); wherein a content of the component (A) is 60 to 90 parts by mass, and a content of the component (B) is 10 to 40 parts by mass, with respect to epoxy resins; the epoxy resin composition has a characteristic that, when cured and formed into a cured product, the cured product has a glass transition temperature of 200° C. or higher; and a viscosity at 100° C. of the resin composition is 5 to 35 Pa.Math.s, wherein Component (A) is an aromatic epoxy resin having at least 3 glycidyl groups in one molecule, Component (B) is an aromatic epoxy resin having two glycidyl groups in one molecule, Component (C) is an aromatic polysulfone resin having a reduced viscosity of 0.18 to 0.30 dl/g; and Component (D) is an aromatic amine compound.

An example fixer composition includes a glycidyl amine resin, an acid, a co-solvent, and a balance of water. The glycidyl amine resin includes at least two epoxide groups, a phenyl group, and a tertiary amine group. The fixer composition may be included in a printing kit with an ink composition. In an example, the ink composition including a pigment, a polymeric binder, and an aqueous ink vehicle.

A sheet molding compound resin composition containing a thermosetting resin (A), a resin-curing agent (B), and a glycidyl ether (C) including an alkyl group having a carbon atom number of 7 to 14 and a glycidyl group is provided. The sheet molding compound resin composition can be favorably used for a sheet molding compound and a molded article of the sheet molding compound as a result of having excellent impregnating ability with respect to carbon fiber regardless of the resin viscosity.

Provided is a photosensitive resin composition which comprises (A) a polymer comprising repeating units represented by formula (A1) and at least one kind of repeating units selected from among repeating units represented by formula (A2) and repeating units represented by formula (A3), (B) an epoxy compound containing four or more epoxy groups on average in the molecule, (C) a photoacid generator, (D) a benzotriazole compound and/or an imidazole compound, and (E) an organic solvent.

##STR00001##

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications, has high Tg, and is excellent in elastic modulus and strength. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (2): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or less, (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less.